发明申请
- 专利标题: SUBSTRATE POLISHING APPARATUS
- 专利标题(中): 基板抛光装置
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申请号: US12700917申请日: 2010-02-05
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公开(公告)号: US20100151770A1公开(公告)日: 2010-06-17
- 发明人: Hidetaka NAKAO , Yasumitsu KAWABATA , Yoshifumi KATSUMATA , Naoki OZAWA , Tatsuya SASAKI , Atsushi SHIGETA
- 申请人: Hidetaka NAKAO , Yasumitsu KAWABATA , Yoshifumi KATSUMATA , Naoki OZAWA , Tatsuya SASAKI , Atsushi SHIGETA
- 优先权: JP422857/2003 20031219; JP209574/2004 20040716
- 主分类号: B24B51/00
- IPC分类号: B24B51/00
摘要:
A substrate polishing apparatus is provided for preventing excessive polishing and insufficient polishing, and enabling a quantitative setting of an additional polishing time. The substrate polishing apparatus comprises a mechanism for polishing a substrate to be polished; a film thickness measuring device for measuring the thickness of a thin film deposited on the substrate; an interface for entering a target thickness for the polished thin film; a storage area for preserving past polishing results; and a processing unit for calculating a polishing time and a polishing rate. The substrate polishing apparatus builds an additional polishing database for storing data acquired from the result of additional polishing in the storage area.
公开/授权文献
- US08388409B2 Substrate polishing apparatus 公开/授权日:2013-03-05