公开(公告)号：US20100151770A1

公开(公告)日：2010-06-17

申请号：US12700917

申请日：2010-02-05

申请人： Hidetaka NAKAO ,  Yasumitsu KAWABATA ,  Yoshifumi KATSUMATA ,  Naoki OZAWA ,  Tatsuya SASAKI ,  Atsushi SHIGETA

发明人： Hidetaka NAKAO ,  Yasumitsu KAWABATA ,  Yoshifumi KATSUMATA ,  Naoki OZAWA ,  Tatsuya SASAKI ,  Atsushi SHIGETA

IPC分类号： B24B51/00

CPC分类号： B24B37/013 ,  B24B49/03 ,  B24B49/12

摘要： A substrate polishing apparatus is provided for preventing excessive polishing and insufficient polishing, and enabling a quantitative setting of an additional polishing time. The substrate polishing apparatus comprises a mechanism for polishing a substrate to be polished; a film thickness measuring device for measuring the thickness of a thin film deposited on the substrate; an interface for entering a target thickness for the polished thin film; a storage area for preserving past polishing results; and a processing unit for calculating a polishing time and a polishing rate. The substrate polishing apparatus builds an additional polishing database for storing data acquired from the result of additional polishing in the storage area.

摘要翻译： 提供了用于防止过度抛光和研磨不足的基板抛光装置，并且能够定量设定额外的抛光时间。 基板抛光装置包括用于抛光待抛光的基板的机构; 用于测量沉积在基板上的薄膜的厚度的膜厚测量装置; 用于输入抛光薄膜的目标厚度的界面; 用于保存过去抛光结果的存储区域; 以及用于计算抛光时间和抛光速率的处理单元。 衬底抛光装置构建另外的抛光数据库，用于存储从存储区域中的附加抛光结果获取的数据。