发明申请
- 专利标题: Functional element-mounted module and a method for producing the same
- 专利标题(中): 功能元件安装模块及其制造方法
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申请号: US12659740申请日: 2010-03-19
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公开(公告)号: US20100175247A1公开(公告)日: 2010-07-15
- 发明人: Yoshihiro Yoneda , Takahiro Asada , Kazuaki Suzuki
- 申请人: Yoshihiro Yoneda , Takahiro Asada , Kazuaki Suzuki
- 申请人地址: JP TOKYO
- 专利权人: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- 当前专利权人: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- 当前专利权人地址: JP TOKYO
- 优先权: JP2006-056141 20060302
- 主分类号: H05K3/34
- IPC分类号: H05K3/34
摘要:
A functional element-mounted module can be decreased in size and requires no costly and special members for a light transition member. A substrate is used, on which an optical functional element having an optical function part and bonding pads therearound is mounted by wire bonding, with an upper face of the element upward. A bank to dam a liquid sealing resin is provided around the optical functional element on the substrate, and the liquid sealing resin is dropped and filled between the optical functional element and the bank such that the bonding pads and partial gold wires for the wire bonding are exposed. A package-component member having a hole corresponding to the optical functional element is abutted to the bank such that the hole is opposed to the function part of the functional element. Thereby, the package-component member is contacted to the liquid sealing resin. The package-component member is fixed to the substrate by curing the liquid sealing resin, and the bank is cut away.