Invention Application
- Patent Title: SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Patent Title (中): 基板处理装置和基板处理方法
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Application No.: US12440400Application Date: 2007-09-05
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Publication No.: US20100175714A1Publication Date: 2010-07-15
- Inventor: Tatsuo Nagai , Hiroshi Morita , Hiroaki Takahashi , Hiroaki Uchida , Toyohide Hayashi
- Applicant: Tatsuo Nagai , Hiroshi Morita , Hiroaki Takahashi , Hiroaki Uchida , Toyohide Hayashi
- Priority: JP2006-241798 20060906
- International Application: PCT/JP2007/067315 WO 20070905
- Main IPC: B08B3/08
- IPC: B08B3/08

Abstract:
A substrate processing apparatus and a substrate processing method, with which a resist can be removed satisfactorily from the substrate and a processing solution used for removing the resist can be recycled, are provided. The substrate processing apparatus includes: a substrate holding means holding a substrate; a peroxosulfuric acid generating means generating a peroxosulfuric acid using sulfuric acid; a mixing means mixing the peroxosulfuric acid generated by the peroxosulfuric acid generating means and sulfuric acid of higher temperature and higher concentration than the sulfuric acid used in the peroxosulfuric acid generating means; and a discharging means discharging, toward the substrate held by the substrate holding means, the mixed solution of the peroxosulfuric acid and the sulfuric acid mixed by the mixing means as a processing solution for removing a resist from the substrate.
Public/Granted literature
- US08038799B2 Substrate processing apparatus and substrate processing method Public/Granted day:2011-10-18
Information query
IPC分类: