SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
    1.
    发明申请
    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 有权
    基板处理装置和基板处理方法

    公开(公告)号:US20100175714A1

    公开(公告)日:2010-07-15

    申请号:US12440400

    申请日:2007-09-05

    CPC classification number: G03F7/423 H01L21/6708

    Abstract: A substrate processing apparatus and a substrate processing method, with which a resist can be removed satisfactorily from the substrate and a processing solution used for removing the resist can be recycled, are provided. The substrate processing apparatus includes: a substrate holding means holding a substrate; a peroxosulfuric acid generating means generating a peroxosulfuric acid using sulfuric acid; a mixing means mixing the peroxosulfuric acid generated by the peroxosulfuric acid generating means and sulfuric acid of higher temperature and higher concentration than the sulfuric acid used in the peroxosulfuric acid generating means; and a discharging means discharging, toward the substrate held by the substrate holding means, the mixed solution of the peroxosulfuric acid and the sulfuric acid mixed by the mixing means as a processing solution for removing a resist from the substrate.

    Abstract translation: 提供了可以从衬底中令人满意地去除抗蚀剂的衬底处理设备和衬底处理方法,并且可以再循环用于除去抗蚀剂的处理溶液。 基板处理装置包括:保持基板的基板保持装置; 使用硫酸生成过氧硫酸的过氧硫酸生成装置; 将由过硫酸产生装置产生的过氧硫酸与比过硫酸产生装置中使用的硫酸更高和更高浓度的硫酸混合的混合装置; 以及排出装置将由所述基板保持装置保持的基板排出由所述混合装置混合的所述过硫酸和所述硫酸的混合溶液作为从所述基板除去抗蚀剂的处理溶液。

    SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS
    2.
    发明申请
    SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS 审中-公开
    基板处理方法和基板处理装置

    公开(公告)号:US20090107522A1

    公开(公告)日:2009-04-30

    申请号:US12255132

    申请日:2008-10-21

    CPC classification number: H01L21/6708 H01L21/67051

    Abstract: An inventive substrate treatment method is performed by a substrate treatment apparatus including a plate having an opposed surface to be kept in opposed spaced relation to one surface of a substrate for treating the substrate with a treatment liquid, and includes: a pre-supply liquid filling step of supplying a pre-supply liquid into a space defined between the one surface of the substrate and the plate through a spout which is provided in the opposed surface in opposed relation to the center of the substrate, and filling the space with the pre-supply liquid, the pre-supply liquid having a smaller contact angle with respect to the substrate and the plate than the treatment liquid; a treatment liquid replacing step of, after a liquid-filled state is established in the space filled with the pre-supply liquid, supplying the treatment liquid into the space to replace the pre-supply liquid present in the space with the treatment liquid while keeping the space in the liquid-filled state; and a treatment liquid contacting step of, after the replacement of the pre-supply liquid, filling the space with the treatment liquid to cause the treatment liquid to contact the one surface of the substrate.

    Abstract translation: 本发明的基板处理方法由基板处理装置进行,该基板处理装置包括具有相对表面的板,以与处理液处理基板的基板的一个表面保持相对间隔的关系,并且包括:预供给液体填充 通过相对于基板的中心设置在相对的表面中的喷口将预供应液供给到在基板的一个表面和板之间限定的空间中的步骤, 供给液体,预处理液体相比于处理液体相对于基板和板具有较小的接触角; 处理液体置换步骤,在填充有预供应液体的空间中建立液体填充状态之后,将处理液供给到空间中以用处理液替换存在于处理液体中的预供应液体,同时保持 液体填充状态的空间; 以及处理液接触步骤,在更换所述预供应液体之后,用所述处理液填充所述空间,以使所述处理液体接触所述基板的所述一个表面。

    Semiconductor wafer and manufacturing method thereof
    5.
    发明授权
    Semiconductor wafer and manufacturing method thereof 失效
    半导体晶片及其制造方法

    公开(公告)号:US07601617B2

    公开(公告)日:2009-10-13

    申请号:US11783669

    申请日:2007-04-11

    Applicant: Hiroaki Uchida

    Inventor: Hiroaki Uchida

    CPC classification number: H01L27/12 H01L21/86 Y10S438/975

    Abstract: The present invention provides a semiconductor wafer comprising an insulated board of sapphire or the like having translucency, which is provided with a positioning orientation flat at a peripheral portion thereof, and a silicon thin film formed over the entire one surface of the insulated board. In the semiconductor wafer, ions are implanted in an area containing the orientation flat at a peripheral portion of the silicon thin film to amorphize silicon. Thus, the translucency at the amorphized spot is eliminated and accurate positioning using the conventional optical sensor can be performed.

    Abstract translation: 本发明提供了一种半导体晶片,其包括半导体的蓝宝石等的绝缘板,其在其周边部分设置有定位取向平面,以及形成在绝缘板的整个表面上的硅薄膜。 在半导体晶片中,将离子注入到在硅薄膜的周边部分包含定向平面的区域中以将硅非晶硅化。 因此,消除了非晶化点处的半透明度,并且可以执行使用常规光学传感器的精确定位。

    Semiconductor wafer and manufacturing method thereof
    6.
    发明授权
    Semiconductor wafer and manufacturing method thereof 失效
    半导体晶片及其制造方法

    公开(公告)号:US07224031B2

    公开(公告)日:2007-05-29

    申请号:US11029648

    申请日:2005-01-06

    Applicant: Hiroaki Uchida

    Inventor: Hiroaki Uchida

    CPC classification number: H01L27/12 H01L21/86 Y10S438/975

    Abstract: The present invention provides a semiconductor wafer comprising an insulated board of sapphire or the like having translucency, which is provided with a positioning orientation flat at a peripheral portion thereof, and a silicon thin film formed over the entire one surface of the insulated board. In the semiconductor wafer, ions are implanted in an area containing the orientation flat at a peripheral portion of the silicon thin film to amorphize silicon. Thus, the translucency at the amorphized spot is eliminated and accurate positioning using the conventional optical sensor can be performed.

    Abstract translation: 本发明提供了一种半导体晶片,其包括半导体的蓝宝石等的绝缘板,其在其周边部分设置有定位取向平面,以及形成在绝缘板的整个表面上的硅薄膜。 在半导体晶片中,将离子注入到在硅薄膜的周边部分包含定向平面的区域中以将硅非晶硅化。 因此,消除了非晶化点处的半透明度,并且可以执行使用常规光学传感器的精确定位。

    Method of Fabricating a capacitor structure having hemispherical grains
    8.
    发明授权
    Method of Fabricating a capacitor structure having hemispherical grains 失效
    制造具有半球形晶粒的电容器结构的方法

    公开(公告)号:US06828207B2

    公开(公告)日:2004-12-07

    申请号:US10352947

    申请日:2003-01-29

    Abstract: A first insulating layer is formed on semiconductor substrate, and a trench is formed in the first insulating layer. An amorphous silicon layer doped with impurities is formed on a side and bottom walls of the trench. Next, a resist material is partially filled in the trench so that an upper portion of the amorphous silicon layer is exposed. The exposed portion is implanted with impurity ions. After removal of the resist material, the amorphous silicon layer is heat treated so as to grow hemispherical grains on its surface.

    Abstract translation: 在半导体衬底上形成第一绝缘层,并且在第一绝缘层中形成沟槽。 掺杂有杂质的非晶硅层形成在沟槽的侧壁和底壁上。 接下来,将抗蚀剂材料部分地填充在沟槽中,使得非晶硅层的上部露出。 暴露部分注入杂质离子。 在去除抗蚀剂材料之后,非晶硅层被热处理以便在其表面上生长半球状晶粒。

Patent Agency Ranking