发明申请
US20100193905A1 Techniques for Placement of Active and Passive Devices Within a Chip 有权
芯片内主动和被动设备放置技术

Techniques for Placement of Active and Passive Devices Within a Chip
摘要:
A semiconductor die includes a semiconductive substrate layer with first and second sides, a metal layer adjacent the second side of the semiconductive substrate layer, one or more active devices in an active layer on the first side of the semiconductive substrate layer; and a passive device in the metal layer in electrical communication with the active layer. The passive device can electrically couple to the active layer with through silicon vias (TSVs).
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