发明申请
- 专利标题: Techniques for Placement of Active and Passive Devices Within a Chip
- 专利标题(中): 芯片内主动和被动设备放置技术
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申请号: US12364844申请日: 2009-02-03
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公开(公告)号: US20100193905A1公开(公告)日: 2010-08-05
- 发明人: Jonghae Kim , Shiqun Gu , Brian Matthew Henderson , Thomas R. Toms , Matthew Nowak
- 申请人: Jonghae Kim , Shiqun Gu , Brian Matthew Henderson , Thomas R. Toms , Matthew Nowak
- 申请人地址: US CA San Diego
- 专利权人: QUALCOMM INCORPORATED
- 当前专利权人: QUALCOMM INCORPORATED
- 当前专利权人地址: US CA San Diego
- 主分类号: H01L27/08
- IPC分类号: H01L27/08 ; H01L21/98
摘要:
A semiconductor die includes a semiconductive substrate layer with first and second sides, a metal layer adjacent the second side of the semiconductive substrate layer, one or more active devices in an active layer on the first side of the semiconductive substrate layer; and a passive device in the metal layer in electrical communication with the active layer. The passive device can electrically couple to the active layer with through silicon vias (TSVs).