发明申请
US20100196592A1 METHODS OF FABRICATING CAPACITORS INCLUDING LOW-TEMPERATURE CAPPING LAYERS
审中-公开
制造电容器的方法,包括低温吸收层
- 专利标题: METHODS OF FABRICATING CAPACITORS INCLUDING LOW-TEMPERATURE CAPPING LAYERS
- 专利标题(中): 制造电容器的方法,包括低温吸收层
-
申请号: US12699576申请日: 2010-02-03
-
公开(公告)号: US20100196592A1公开(公告)日: 2010-08-05
- 发明人: Wan-Don Kim , Kyu-Ho Cho , Jin-Yong Kim , Jae-Hyoung Choi , Jae-Soon Lim , Oh-Seong Kwon , Beom-Seok Kim , Yong-Suk Tak
- 申请人: Wan-Don Kim , Kyu-Ho Cho , Jin-Yong Kim , Jae-Hyoung Choi , Jae-Soon Lim , Oh-Seong Kwon , Beom-Seok Kim , Yong-Suk Tak
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 优先权: KR10-2009-0008812 20090204
- 主分类号: B05D5/12
- IPC分类号: B05D5/12
摘要:
In a method of fabricating a capacitor, a lower electrode is formed, and a dielectric layer is formed on the lower electrode. An upper electrode is foamed on the dielectric layer opposite the lower electrode. A low-temperature capping layer is formed on the upper electrode at a temperature of less than about 300° C. Related devices and fabrication methods are also discussed.
信息查询