发明申请
- 专利标题： ON-CHIP HEATER AND METHODS FOR FABRICATION THEREOF AND USE THEREOF
- 专利标题（中）： 片上加热器及其制造方法及其用途
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申请号： US12766342申请日： 2010-04-23
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公开(公告)号： US20100200953A1公开(公告)日： 2010-08-12
- 发明人: Ethan H. Cannon , Alvin W. Strong
- 申请人： Ethan H. Cannon , Alvin W. Strong
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L29/86
- IPC分类号： H01L29/86 ; H01L21/26
摘要：
An on-chip heater and methods for fabrication thereof and use thereof provide that the heater is located within an isolation region that in turn is located within a semiconductor substrate. The heater has a thermal output capable or raising the semiconductor substrate to a temperature of at least about 200° C. The heater may be used for thermally annealing trapped charges within dielectric layers within the semiconductor structure.
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