Invention Application
- Patent Title: HEAT-EXPANDABLE MICROSPHERES, PROCESS FOR PRODUCING THE SAME, AND APPLICATION THEREOF
- Patent Title (中): 热可膨胀微球，其生产方法及其应用
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Application No.: US12679661Application Date: 2008-10-09
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Publication No.: US20100204349A1Publication Date: 2010-08-12
- Inventor: Takeshi Inohara , Yoshiaki Shirakabe , Ikuo Yosejima , Kenichi Kitano , Toshiaki Masuda
- Applicant: Takeshi Inohara , Yoshiaki Shirakabe , Ikuo Yosejima , Kenichi Kitano , Toshiaki Masuda
- Applicant Address: JP Yao-shi, Osaka
- Assignee: MATSUMOTO YUSHI-SEIYAKU CO., LTD.
- Current Assignee: MATSUMOTO YUSHI-SEIYAKU CO., LTD.
- Current Assignee Address: JP Yao-shi, Osaka
- Priority: JP2007-268476 20071016
- International Application: PCT/JP2008/002847 WO 20081009
- Main IPC: C08J9/16
- IPC: C08J9/16 ; B32B19/00
Abstract:
Heat-expandable microspheres include a shell of thermoplastic resin and core material encapsulated in the shell. The core material include a blowing agent having a boiling point not higher than the softening point of the thermoplastic resin and a gas migration inhibitor having a boiling point higher than the softening point of the thermoplastic resin. The ratio of the gas migration inhibitor to the core material is at least 1 weight percent and below 30 weight percent. The average particle size of the heat-expandable microspheres ranges from 1 to 100 micrometers.
Public/Granted literature
- US08247465B2 Heat-expandable microspheres, process for producing the same, and application thereof Public/Granted day:2012-08-21
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