发明申请
- 专利标题: PAD DESIGN FOR BACKSIDE ILLUMINATED IMAGE SENSOR
- 专利标题(中): 背面照明图像传感器的PAD设计
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申请号: US12708167申请日: 2010-02-18
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公开(公告)号: US20100213560A1公开(公告)日: 2010-08-26
- 发明人: Wen-De Wang , Dun-Nian Yaung , Jen-Cheng Liu , Chun-Chieh Chuang , Jeng-Shyan Lin
- 申请人: Wen-De Wang , Dun-Nian Yaung , Jen-Cheng Liu , Chun-Chieh Chuang , Jeng-Shyan Lin
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址: TW Hsinchu
- 主分类号: H01L27/146
- IPC分类号: H01L27/146 ; H01L31/0232 ; H01L31/18
摘要:
A semiconductor image sensor device includes first and second semiconductor substrates. A pixel array and a control circuit are formed in a first surface of the first substrate. An interconnect layer is formed over the first surface of the first substrate and electrically connects the control circuit to the pixel array. A top conducting layer is formed over the interconnect layer to have electrical connectivity with at least one of the control circuit or the pixel array via the interconnect layer. A surface of a second substrate is bonded to the top conducting layer. A conductive through-silicon-via (TSV) passes through the second substrate, and has electrical connectivity with the top conducting layer. A terminal is formed on an opposite surface of the second substrate, and electrically connected to the TSV.
公开/授权文献
- US09142586B2 Pad design for backside illuminated image sensor 公开/授权日:2015-09-22