发明申请
- 专利标题： INTEGRATED CIRCUIT HEAT SPREADER STACKING SYSTEM
- 专利标题（中）： 集成电路散热器堆叠系统
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申请号： US12781772申请日： 2010-05-17
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公开(公告)号： US20100224991A1公开(公告)日： 2010-09-09
- 发明人: Dario S. Filoteo, JR. , Emmanuel Espiritu , Philip Lyndon Cablao
- 申请人： Dario S. Filoteo, JR. , Emmanuel Espiritu , Philip Lyndon Cablao
- 主分类号： H01L23/367
- IPC分类号： H01L23/367
摘要：
An integrated circuit heat spreader stacking system includes: an integrated circuit on a substrate; a heat spreader having a heat sink dome; a stacking stand-off for the heat spreader; and the heat spreader mounted with the heat sink dome over the integrated circuit.
公开/授权文献
- US08421221B2 Integrated circuit heat spreader stacking system 公开/授权日：2013-04-16
信息查询
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