公开(公告)号：US20110140261A1

公开(公告)日：2011-06-16

申请号：US12636696

申请日：2009-12-11

申请人： Zigmund Ramirez Camacho ,  Philip Lyndon Cablao ,  Lionel Chien Hui Tay ,  Frederick Rodriguez Dahilig

发明人： Zigmund Ramirez Camacho ,  Philip Lyndon Cablao ,  Lionel Chien Hui Tay ,  Frederick Rodriguez Dahilig

IPC分类号： H01L23/498 ,  H01L21/768 ,  H01L21/56

CPC分类号： H01L21/568 ,  H01L21/4846 ,  H01L21/486 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a substrate external layer having an opening; forming a convex interconnect within the opening with the convex interconnect having a protrusion and a horizontal flange substantially horizontally coplanar with the substrate external layer; forming an insulation layer over the substrate external layer and the convex interconnect; forming a horizontal conductive pathway on the insulation layer; forming a single interlayer conductive connector from the horizontal conductive pathway to the convex interconnect; and connecting an integrated circuit and the horizontal conductive pathway.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有开口的基板外层; 在所述开口内形成凸形互连件，所述凸起互连件具有突出部和与所述基板外部层基本上水平共面的水平凸缘; 在所述衬底外层和所述凸互连之上形成绝缘层; 在绝缘层上形成水平导电通路; 从所述水平导电路径形成单层间导电连接器到所述凸互连; 并连接集成电路和水平导电通路。

公开(公告)号：US07911046B2

公开(公告)日：2011-03-22

申请号：US12391807

申请日：2009-02-24

申请人： Philip Lyndon Cablao ,  Rachel Layda Abinan ,  Dario S. Filoteo, Jr. ,  Allan P. Ilagan

发明人： Philip Lyndon Cablao ,  Rachel Layda Abinan ,  Dario S. Filoteo, Jr. ,  Allan P. Ilagan

IPC分类号： H01L23/00

CPC分类号： H01L24/83 ,  H01L23/13 ,  H01L24/16 ,  H01L24/28 ,  H01L24/31 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L25/0652 ,  H01L25/162 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/4911 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2224/16225 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/16145 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit packaging system is provided including forming an interposer having a coupling slot, securing an upper die on the interposer, mounting the interposer over an integrated circuit, and coupling the integrated circuit to the upper die through the coupling slot.

摘要翻译： 提供了一种集成电路封装系统，包括形成具有耦合槽的插入件，将上模固定在插入器上，将插入件安装在集成电路上，并通过耦合槽将集成电路耦合到上模。

公开(公告)号：US08304921B2

公开(公告)日：2012-11-06

申请号：US12618417

申请日：2009-11-13

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Allan P. Ilagan ,  Philip Lyndon Cablao

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Allan P. Ilagan ,  Philip Lyndon Cablao

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/30

CPC分类号： H01L23/49838 ,  H01L21/4846 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/3121 ,  H01L24/06 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2221/68345 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05647 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48487 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a planar support structure having a cavity; forming a terminal within the cavity with the terminal coplanar with the planar support structure; forming a conductive pathway on the terminal and the planar support structure with the conductive pathway having a route portion and an interconnect attach portion at the end of the route portion; connecting a device and the interconnect attach portion with the interconnect attach portion towards the device; and forming an encapsulation over the planar support structure covering the conductive pathway and the device.

摘要翻译： 一种制造集成电路封装系统的方法包括：提供具有空腔的平面支撑结构; 在所述腔内形成端子，所述端子与所述平面支撑结构共面; 在所述端子和所述平面支撑结构上形成导电路径，所述导电路径在路线部分的末端具有路线部分和互连附接部分; 将设备和所述互连附接部分与所述互连附接部分朝向所述设备连接; 以及在覆盖所述导电路径和所述装置的所述平面支撑结构上形成封装。

公开(公告)号：US08344495B2

公开(公告)日：2013-01-01

申请号：US12636696

申请日：2009-12-11

申请人： Zigmund Ramirez Camacho ,  Philip Lyndon Cablao ,  Lionel Chien Hui Tay ,  Frederick Rodriguez Dahilig

发明人： Zigmund Ramirez Camacho ,  Philip Lyndon Cablao ,  Lionel Chien Hui Tay ,  Frederick Rodriguez Dahilig

IPC分类号： H01L23/498

CPC分类号： H01L21/568 ,  H01L21/4846 ,  H01L21/486 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a substrate external layer having an opening; forming a convex interconnect within the opening with the convex interconnect having a protrusion and a horizontal flange substantially horizontally coplanar with the substrate external layer; forming an insulation layer over the substrate external layer and the convex interconnect; forming a horizontal conductive pathway on the insulation layer; forming a single interlayer conductive connector from the horizontal conductive pathway to the convex interconnect; and connecting an integrated circuit and the horizontal conductive pathway.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有开口的基板外层; 在所述开口内形成凸形互连件，所述凸起互连件具有突出部和与所述基板外部层基本上水平共面的水平凸缘; 在所述衬底外层和所述凸互连之上形成绝缘层; 在绝缘层上形成水平导电通路; 从所述水平导电路径形成单层间导电连接器到所述凸互连; 并连接集成电路和水平导电通路。

公开(公告)号：US20080185719A1

公开(公告)日：2008-08-07

申请号：US11671684

申请日：2007-02-06

申请人： Philip Lyndon Cablao ,  Rachel Layda Abinan ,  Dario S. Filoteo ,  Allan P. Ilagan

发明人： Philip Lyndon Cablao ,  Rachel Layda Abinan ,  Dario S. Filoteo ,  Allan P. Ilagan

IPC分类号： H01L23/538 ,  H01L21/58

CPC分类号： H01L24/83 ,  H01L23/13 ,  H01L24/16 ,  H01L24/28 ,  H01L24/31 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L25/0652 ,  H01L25/162 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/4911 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2224/16225 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/16145 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit packaging system is provided including forming an interposer having a coupling slot, securing an upper die on the interposer, mounting the interposer over an integrated circuit, and coupling the integrated circuit to the upper die through the coupling slot.

摘要翻译： 提供了一种集成电路封装系统，包括形成具有耦合槽的插入件，将上模固定在插入器上，将插入件安装在集成电路上，并通过耦合槽将集成电路耦合到上模。

公开(公告)号：US08138080B2

公开(公告)日：2012-03-20

申请号：US11276716

申请日：2006-03-10

申请人： Dario S. Filoteo, Jr. ,  Leo A. Merilo ,  Philip Lyndon Cablao ,  Emmanuel Espiritu ,  Rachel Layda Abinan ,  Allan Ilagan

发明人： Dario S. Filoteo, Jr. ,  Leo A. Merilo ,  Philip Lyndon Cablao ,  Emmanuel Espiritu ,  Rachel Layda Abinan ,  Allan Ilagan

IPC分类号： H01L21/44

CPC分类号： H01L23/4952 ,  H01L23/3107 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/48997 ,  H01L2224/49113 ,  H01L2224/49425 ,  H01L2224/73265 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2224/85951 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/48455 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system is provided forming an integrated circuit die having a first bond pad provided thereon, forming an interconnect stack on a first external interconnect, and connecting the interconnect stack to the first bond pad.

摘要翻译： 提供集成电路封装系统，其形成具有设置在其上的第一接合焊盘的集成电路管芯，在第一外部互连上形成互连堆叠，以及将互连堆叠连接到第一接合焊盘。

公开(公告)号：US08026129B2

公开(公告)日：2011-09-27

申请号：US11276682

申请日：2006-03-10

申请人： Philip Lyndon Cablao ,  Dario S. Filoteo, Jr. ,  Leo A. Merilo ,  Emmanuel Espiritu ,  Rachel Layda Abinan ,  Allan Ilagan

发明人： Philip Lyndon Cablao ,  Dario S. Filoteo, Jr. ,  Leo A. Merilo ,  Emmanuel Espiritu ,  Rachel Layda Abinan ,  Allan Ilagan

IPC分类号： H01L21/00

CPC分类号： H01L25/162 ,  H01L23/49816 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/06596 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A stacked integrated circuit package system is provided forming a first stack layer having a first integrated circuit die on a first substrate, forming a second stack layer having a second integrated circuit die on a second substrate, and mechanically and electrically connecting a spacer layer having a first passive component between the second stack layer and the first stack layer.

摘要翻译： 提供一种堆叠式集成电路封装系统，其形成在第一衬底上具有第一集成电路裸片的第一堆叠层，在第二衬底上形成具有第二集成电路裸片的第二堆叠层，以及机械地和电连接具有 第二堆叠层和第一堆叠层之间的第一无源部件。

公开(公告)号：US20110115065A1

公开(公告)日：2011-05-19

申请号：US12618417

申请日：2009-11-13

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Allan P. Ilagan ,  Philip Lyndon Cablao

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Allan P. Ilagan ,  Philip Lyndon Cablao

IPC分类号： H01L23/52 ,  H01L21/60

CPC分类号： H01L23/49838 ,  H01L21/4846 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/3121 ,  H01L24/06 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2221/68345 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05647 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48487 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a planar support structure having a cavity; forming a terminal within the cavity with the terminal coplanar with the planar support structure; forming a conductive pathway on the terminal and the planar support structure with the conductive pathway having a route portion and an interconnect attach portion at the end of the route portion; connecting a device and the interconnect attach portion with the interconnect attach portion towards the device; and forming an encapsulation over the planar support structure covering the conductive pathway and the device.

摘要翻译： 一种制造集成电路封装系统的方法包括：提供具有空腔的平面支撑结构; 在所述腔内形成端子，所述端子与所述平面支撑结构共面; 在所述端子和所述平面支撑结构上形成导电路径，所述导电路径在路线部分的末端具有路线部分和互连附接部分; 将设备和所述互连附接部分与所述互连附接部分朝向所述设备连接; 以及在覆盖所述导电路径和所述装置的所述平面支撑结构上形成封装。

公开(公告)号：US20100224991A1

公开(公告)日：2010-09-09

申请号：US12781772

申请日：2010-05-17

申请人： Dario S. Filoteo, JR. ,  Emmanuel Espiritu ,  Philip Lyndon Cablao

发明人： Dario S. Filoteo, JR. ,  Emmanuel Espiritu ,  Philip Lyndon Cablao

IPC分类号： H01L23/367

CPC分类号： H01L23/4334 ,  H01L23/3128 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2224/0401

摘要： An integrated circuit heat spreader stacking system includes: an integrated circuit on a substrate; a heat spreader having a heat sink dome; a stacking stand-off for the heat spreader; and the heat spreader mounted with the heat sink dome over the integrated circuit.

摘要翻译： 一种集成电路散热器堆叠系统，包括：基板上的集成电路; 具有散热器圆顶的散热器; 用于散热器的堆叠支架; 并且散热器安装有集成电路上的散热器圆顶。

公开(公告)号：US07759169B2

公开(公告)日：2010-07-20

申请号：US11456846

申请日：2006-07-11

申请人： Dario S. Filoteo, Jr. ,  Emmanuel Espiritu ,  Philip Lyndon Cablao

发明人： Dario S. Filoteo, Jr. ,  Emmanuel Espiritu ,  Philip Lyndon Cablao

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/4334 ,  H01L23/3128 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2224/0401

摘要： An integrated circuit heat spreader stacking system is provided including mounting an integrated circuit on a substrate, forming a heat spreader, forming a stacking stand-off for the heat spreader, and mounting a heat spreader over the integrated circuit.

摘要翻译： 提供一种集成电路散热器堆叠系统，包括将集成电路安装在基板上，形成散热器，形成用于散热器的堆叠支架，以及将散热器安装在集成电路上。