发明申请
US20100231088A1 WAFER, WAFER POLISHING APPARATUS, WAFER POLISHING METHOD, METHOD OF FABRICATING PIEZOELECTRIC VIBRATOR, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS AND RADIOWAVE TIMEPIECE
有权
滤波器，抛光抛光装置，波浪抛光方法，压电振动器，压电振动器，振荡器，电子装置和放射线计时器的制造方法
- 专利标题： WAFER, WAFER POLISHING APPARATUS, WAFER POLISHING METHOD, METHOD OF FABRICATING PIEZOELECTRIC VIBRATOR, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS AND RADIOWAVE TIMEPIECE
- 专利标题（中）： 滤波器，抛光抛光装置，波浪抛光方法，压电振动器，压电振动器，振荡器，电子装置和放射线计时器的制造方法
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申请号： US12361913申请日： 2009-01-29
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公开(公告)号： US20100231088A1公开(公告)日： 2010-09-16
- 发明人: Takashi Kobayashi
- 申请人： Takashi Kobayashi
- 优先权： JPJP2008-033070 20080214
- 主分类号： H01L41/00
- IPC分类号： H01L41/00 ; B24C3/32 ; B24B1/00
摘要：
To provide a wafer preventing a breakage of a crack or a chip off from being brought about in a polishing step and a polishing apparatus and a polishing method of polishing the wafer, there is provided a wafer in a shape of a plate substantially in an angular rectangular shape used as a raw material of a piezoelectric vibrator. All of corner portions D1, D2, D3, D4 substantially in the angular shape are formed in shapes of curved faces by chamfering providing curvatures. The corner portions D1, D2, D3, D4 in the shapes of the curved faces at least include a first curved face portion and a second curved face portion chamfered by curvatures different from each other or the same curvature. A reference face of a crystal orientation of the raw material is specified by the first curved face portion or the second curved face portion.
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