发明申请
US20100233361A1 METAL NANOPARTICLE COMPOSITION WITH IMPROVED ADHESION 审中-公开
金属纳米材料组合物具有改进的粘合性

METAL NANOPARTICLE COMPOSITION WITH IMPROVED ADHESION
摘要:
A composition that may be as an electronic circuit element includes a metal nanoparticle, an adhesion promoter compound and a solvent. The adhesion promoter compound may be a hydrolytic silane with at least one organic functional moiety. A method of forming conductive features on a substrate includes depositing a composition containing metal nanoparticles, an adhesion promoter compound and a solvent onto a substrate, and heating the deposited composition to a temperature from about 100° C. to about 200° C.
信息查询
0/0