发明申请
- 专利标题: THIN PROFILE CONDUCTOR ASSEMBLY FOR MEDICAL DEVICE LEADS
- 专利标题(中): 医疗设备导线薄型导线器总成
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申请号: US12704939申请日: 2010-02-12
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公开(公告)号: US20100234929A1公开(公告)日: 2010-09-16
- 发明人: Torsten Scheuermann
- 申请人: Torsten Scheuermann
- 主分类号: A61N1/02
- IPC分类号: A61N1/02 ; H01B7/00 ; B05D5/12
摘要:
A medical device lead includes a thin profile conductor assembly. A proximal connector includes a proximal end that is configured to couple the lead to a pulse generator. An insulative lead body extends distally from the proximal connector. The conductor assembly extends distally from the proximal end within the lead body and includes a non-conductive tubular core member that defines a lumen, an outer insulative layer, and a multilayer conductor between the tubular core member and the outer insulative layer. The multilayer conductor is electrically connected to the proximal connector and includes a first conductive layer adjacent to the tubular core member and a second conductive layer adjacent to the first conductive layer opposite the tubular core member. A conductivity of the second conductive layer is greater than a conductivity of the first conductive layer.
公开/授权文献
- US09084883B2 Thin profile conductor assembly for medical device leads 公开/授权日:2015-07-21
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