A thermal imaging microelectronic device comprising: a support (200), a plurality of metal levels (M1, . . . , M5, M6) for interconnecting electronic components formed on the support, an array of thermal detectors formed on the support, each detector including a membrane (210) with which radiant energy may be absorbed and one or more electric signals may be provide depending on the absorbed radiant energy, and means for reading out the electric signals from the membrane, the readout means being integrated to the support, at least several of said detectors having readout means provided with an integrator comprising at least one MIM integration capacitor formed facing the membrane, the MIM capacitor having at least one upper plate (244) made in a given interconnection metal level of said plurality of interconnection metal levels (M1, . . . , M5, M6).