发明申请
- 专利标题： ABRASIVE TOOL FOR USE AS A CHEMICAL MECHANICAL PLANARIZATION PAD CONDITIONER
- 专利标题（中）： 用作化学机械平面调节器的磨料工具
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申请号： US12651326申请日： 2009-12-31
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公开(公告)号： US20100248595A1公开(公告)日： 2010-09-30
- 发明人: Charles Dinh-Ngoc , Srinivasan Ramanath , Eric M. Schulz , Jianhui Wu , Thomas Puthanangady , Ramanujam Vedantham , Taewook Hwang
- 申请人： Charles Dinh-Ngoc , Srinivasan Ramanath , Eric M. Schulz , Jianhui Wu , Thomas Puthanangady , Ramanujam Vedantham , Taewook Hwang
- 申请人地址： US MA Worcester FR Conflans-Sainte-Honorine
- 专利权人： SAINT-GOBAIN ABRASIVES, INC.,SAINT-GOBAIN ABRASIFS
- 当前专利权人： SAINT-GOBAIN ABRASIVES, INC.,SAINT-GOBAIN ABRASIFS
- 当前专利权人地址： US MA Worcester FR Conflans-Sainte-Honorine
- 主分类号： B24B53/02
- IPC分类号： B24B53/02 ; B24B53/12
摘要：
An abrasive tool including a CMP pad conditioner having a substrate including a first major surface, a second major surface opposite the first major surface, and a side surface extending between the first major surface and the second major, wherein a first layer of abrasive grains is attached to the first major surface and a second layer of abrasive grains is attached to the second major surface. The conditioner further includes a first sealing member extending in a peripheral direction along a portion of the side surface of the substrate.