公开(公告)号：US08342910B2

公开(公告)日：2013-01-01

申请号：US12651326

申请日：2009-12-31

申请人： Charles Dinh-Ngoc ,  Srinivasan Ramanath ,  Eric M. Schulz ,  Jianhui Wu ,  Thomas Puthanangady ,  Ramanujam Vedantham ,  Taewook Hwang

发明人： Charles Dinh-Ngoc ,  Srinivasan Ramanath ,  Eric M. Schulz ,  Jianhui Wu ,  Thomas Puthanangady ,  Ramanujam Vedantham ,  Taewook Hwang

IPC分类号： B24B1/00

CPC分类号： B24B53/017 ,  B24B37/04 ,  B24B53/12

摘要： An abrasive tool including a CMP pad conditioner having a substrate including a first major surface, a second major surface opposite the first major surface, and a side surface extending between the first major surface and the second major, wherein a first layer of abrasive grains is attached to the first major surface and a second layer of abrasive grains is attached to the second major surface. The conditioner further includes a first sealing member extending in a peripheral direction along a portion of the side surface of the substrate.

公开(公告)号：US20100248595A1

公开(公告)日：2010-09-30

申请号：US12651326

申请日：2009-12-31

申请人： Charles Dinh-Ngoc ,  Srinivasan Ramanath ,  Eric M. Schulz ,  Jianhui Wu ,  Thomas Puthanangady ,  Ramanujam Vedantham ,  Taewook Hwang

发明人： Charles Dinh-Ngoc ,  Srinivasan Ramanath ,  Eric M. Schulz ,  Jianhui Wu ,  Thomas Puthanangady ,  Ramanujam Vedantham ,  Taewook Hwang

IPC分类号： B24B53/02 ,  B24B53/12

CPC分类号： B24B53/017 ,  B24B37/04 ,  B24B53/12

摘要： An abrasive tool including a CMP pad conditioner having a substrate including a first major surface, a second major surface opposite the first major surface, and a side surface extending between the first major surface and the second major, wherein a first layer of abrasive grains is attached to the first major surface and a second layer of abrasive grains is attached to the second major surface. The conditioner further includes a first sealing member extending in a peripheral direction along a portion of the side surface of the substrate.

摘要翻译： 一种研磨工具，包括具有基材的CMP垫调节剂，所述基材包括第一主表面，与第一主表面相对的第二主表面和在第一主表面和第二主表面之间延伸的侧表面，其中第一磨料颗粒层为 附着在第一主表面上，第二层磨料颗粒附着在第二主表面上。 调节器还包括沿着基板的侧表面的一部分沿周向方向延伸的第一密封构件。

公开(公告)号：US09022840B2

公开(公告)日：2015-05-05

申请号：US13682524

申请日：2012-11-20

申请人： Charles Dinh-Ngoc ,  Srinivasan Ramanath ,  Eric M. Schulz ,  Jianhui Wu ,  Thomas Puthanangady ,  Ramanujam Vedantham ,  Taewook Hwang

发明人： Charles Dinh-Ngoc ,  Srinivasan Ramanath ,  Eric M. Schulz ,  Jianhui Wu ,  Thomas Puthanangady ,  Ramanujam Vedantham ,  Taewook Hwang

IPC分类号： B24B53/12 ,  B24B53/017 ,  B24B37/04

CPC分类号： B24B53/017 ,  B24B37/04 ,  B24B53/12

摘要： An abrasive tool including a CMP pad conditioner having a substrate including a first major surface, a second major surface opposite the first major surface, and a side surface extending between the first major surface and the second major, wherein a first layer of abrasive grains is attached to the first major surface and a second layer of abrasive grains is attached to the second major surface. The conditioner further includes a first sealing member extending in a peripheral direction along a portion of the side surface of the substrate.

摘要翻译： 一种研磨工具，包括具有基材的CMP垫调节剂，所述基材包括第一主表面，与第一主表面相对的第二主表面和在第一主表面和第二主表面之间延伸的侧表面，其中第一磨料颗粒层为 附着在第一主表面上，第二层磨料颗粒附着在第二主表面上。 调节器还包括沿着基板的侧表面的一部分沿周向方向延伸的第一密封构件。

公开(公告)号：US20130078895A1

公开(公告)日：2013-03-28

申请号：US13682524

申请日：2012-11-20

申请人： Charles Dinh-Ngoc ,  Srinivasan Ramanath ,  Eric M. Schulz ,  Jianhui Wu ,  Thomas Puthanangady ,  Ramanujam Vedantham ,  Taewook Hwang

发明人： Charles Dinh-Ngoc ,  Srinivasan Ramanath ,  Eric M. Schulz ,  Jianhui Wu ,  Thomas Puthanangady ,  Ramanujam Vedantham ,  Taewook Hwang

IPC分类号： B24B53/017

CPC分类号： B24B53/017 ,  B24B37/04 ,  B24B53/12

摘要： An abrasive tool including a CMP pad conditioner having a substrate including a first major surface, a second major surface opposite the first major surface, and a side surface extending between the first major surface and the second major, wherein a first layer of abrasive grains is attached to the first major surface and a second layer of abrasive grains is attached to the second major surface. The conditioner further includes a first sealing member extending in a peripheral direction along a portion of the side surface of the substrate.

摘要翻译： 一种研磨工具，包括具有基材的CMP垫调节剂，所述基材包括第一主表面，与第一主表面相对的第二主表面和在第一主表面和第二主表面之间延伸的侧表面，其中第一磨料颗粒层为 附着在第一主表面上，第二层磨料颗粒附着在第二主表面上。 调节器还包括沿着基板的侧表面的一部分沿周向方向延伸的第一密封构件。

公开(公告)号：US08905823B2

公开(公告)日：2014-12-09

申请号：US12791391

申请日：2010-06-01

申请人： Jianhui Wu ,  Taewook Hwang ,  Ramanujam Vedantham ,  Charles Dinh-Ngoc ,  Thomas K. Puthanangady ,  Eric M. Schulz ,  Srinivasan Ramanath

发明人： Jianhui Wu ,  Taewook Hwang ,  Ramanujam Vedantham ,  Charles Dinh-Ngoc ,  Thomas K. Puthanangady ,  Eric M. Schulz ,  Srinivasan Ramanath

IPC分类号： B24B53/12 ,  B24B53/017 ,  B24D3/08 ,  B24D18/00

CPC分类号： B24B53/017 ,  B24B53/12 ,  B24D3/08 ,  B24D18/00

摘要： An abrasive tool for conditioning CMP pads includes abrasive grains coupled to a substrate through a metal bond and a coating, e.g., a fluorine-doped nanocomposite coating. The abrasive grains can be arranged in a self-avoiding random distribution. In one implementation, an abrasive tool includes a coated plate and a coated abrasive article that has two abrading surfaces. Other implementations related to a process for producing an abrasive tool that includes a coating at one or more of its surfaces. Also described are methods for dressing a CMP pad.

摘要翻译： 用于调节CMP垫的研磨工具包括通过金属键和涂层（例如氟掺杂的纳米复合涂层）与基底相连的磨料颗粒。 磨粒可以以自回避的随机分布布置。 在一个实施方案中，研磨工具包括涂覆的板和具有两个研磨表面的涂覆的磨料制品。 涉及用于生产研磨工具的方法的其它实施方式，其包括在其一个或多个表面上的涂层。 还描述了用于修整CMP垫的方法。

公开(公告)号：US20100330886A1

公开(公告)日：2010-12-30

申请号：US12791391

申请日：2010-06-01

申请人： Jianhui Wu ,  Taewook Hwang ,  Ramanujam Vedantham ,  Charles Dinh-Ngoc ,  Thomas K. Puthanangady ,  Eric M. Schulz ,  Srinivasan Ramanath

发明人： Jianhui Wu ,  Taewook Hwang ,  Ramanujam Vedantham ,  Charles Dinh-Ngoc ,  Thomas K. Puthanangady ,  Eric M. Schulz ,  Srinivasan Ramanath

IPC分类号： B24D7/18 ,  B24D18/00 ,  B24B53/02 ,  B24B41/00

CPC分类号： B24B53/017 ,  B24B53/12 ,  B24D3/08 ,  B24D18/00

摘要： An abrasive tool for conditioning CMP pads includes abrasive grains coupled to a substrate through a metal bond and a coating, e.g., a fluorine-doped nanocomposite coating. The abrasive grains can be arranged in a self-avoiding random distribution. In one implementation, an abrasive tool includes a coated plate and a coated abrasive article that has two abrading surfaces. Other implementations related to a process for producing an abrasive tool that includes a coating at one or more of its surfaces. Also described are methods for dressing a CMP pad.

摘要翻译： 用于调节CMP垫的研磨工具包括通过金属键和涂层（例如氟掺杂的纳米复合涂层）与基底相连的磨料颗粒。 磨粒可以以自回避的随机分布布置。 在一个实施方案中，研磨工具包括涂覆的板和具有两个研磨表面的涂覆的磨料制品。 涉及用于生产研磨工具的方法的其它实施方式，其包括在其一个或多个表面上的涂层。 还描述了用于修整CMP垫的方法。

公开(公告)号：US20120220205A1

公开(公告)日：2012-08-30

申请号：US13393774

申请日：2010-08-31

申请人： Jianhui Wu ,  Richard W. J. Hall ,  Eric M. Schulz ,  Srinivasan Ramanath

发明人： Jianhui Wu ,  Richard W. J. Hall ,  Eric M. Schulz ,  Srinivasan Ramanath

IPC分类号： B24B53/017 ,  B32B18/00

CPC分类号： B24B53/007

摘要： A chemical mechanical polishing (CMP) conditioner includes a ceramic substrate having a major surface, and an abrasive coating overlying the major surface. The major surface can include micro-protrusions arranged in a curved pattern. Alternatively, the micro-protrusions can be arranged in an irregular pattern.

摘要翻译： 化学机械抛光（CMP）调理剂包括具有主表面的陶瓷基材和覆盖主表面的研磨涂层。 主表面可以包括以弯曲图案布置的微突起。 或者，微突起可以以不规则图案排列。

公开(公告)号：US08951099B2

公开(公告)日：2015-02-10

申请号：US13393774

申请日：2010-08-31

申请人： Jianhui Wu ,  Richard W. J. Hall ,  Eric M. Schulz ,  Srinivasan Ramanath

发明人： Jianhui Wu ,  Richard W. J. Hall ,  Eric M. Schulz ,  Srinivasan Ramanath

IPC分类号： B24B53/00 ,  B24B53/007

CPC分类号： B24B53/007

摘要： A chemical mechanical polishing (CMP) conditioner includes a ceramic substrate having a major surface, and an abrasive coating overlying the major surface. The major surface can include micro-protrusions arranged in a curved pattern. Alternatively, the micro-protrusions can be arranged in an irregular pattern.

摘要翻译： 化学机械抛光（CMP）调理剂包括具有主表面的陶瓷基材和覆盖主表面的研磨涂层。 主表面可以包括以弯曲图案布置的微突起。 或者，微突起可以以不规则图案排列。

公开(公告)号：US20120149287A1

公开(公告)日：2012-06-14

申请号：US13324146

申请日：2011-12-13

申请人： Jianhui Wu ,  Eric M. Schulz ,  Srinivasan Ramanath ,  Arup K. Khaund

发明人： Jianhui Wu ,  Eric M. Schulz ,  Srinivasan Ramanath ,  Arup K. Khaund

IPC分类号： B24B53/017 ,  B24D18/00 ,  B24D3/06

CPC分类号： B24B53/017 ,  B24D3/06 ,  B24D18/00

摘要： A method of forming a chemical mechanical planarization (CMP) pad conditioner includes placing abrasive grains on a major surface of a substrate, forming a binding composition at an exterior surface of the abrasive grains, and depositing a bonding layer over the surface of the substrate and a portion of the abrasive grains to secure the abrasive grains to the major surface of the substrate.

摘要翻译： 形成化学机械平坦化（CMP）垫调节剂的方法包括将磨料颗粒放置在基材的主表面上，在磨粒的外表面上形成粘合组合物，并在基材的表面上沉积粘结层， 一部分磨料颗粒将磨料颗粒固定在基材的主表面上。

公开(公告)号：US07195549B2

公开(公告)日：2007-03-27

申请号：US10924027

申请日：2004-08-23

申请人： J. Gary Baldoni ,  Sergej-Tomislav Buljan ,  Eric M. Schulz

发明人： J. Gary Baldoni ,  Sergej-Tomislav Buljan ,  Eric M. Schulz

IPC分类号： B34D5/06

CPC分类号： B24D5/06

摘要： A drum grinding wheel includes an elongated drum configured for coaxial engagement with a spindle of a grinding machine. An exterior surface of the drum extends parallel to a central axis, and a plurality of removable cutters are removably fastened to the exterior surface. Each of the cutters has a plurality of ribs disposed in spaced relation thereon, and abrasive grain is disposed on a grinding face of each of the ribs, such as by use of a metallic braze.

摘要翻译： 滚筒砂轮包括配置成与研磨机的主轴同轴接合的细长滚筒。 鼓的外表面平行于中心轴线延伸，并且多个可移除的切割器可拆卸地紧固到外表面。 每个切割器具有以间隔关系设置的多个肋，并且磨料颗粒例如通过使用金属钎焊设置在每个肋的研磨面上。