发明申请
- 专利标题： CIRCUIT DEVICE, METHOD OF MANUFACTURING THE CIRCUIT DEVICE, DEVICE MOUNTING BOARD AND SEMICONDUCTOR MODULE
- 专利标题（中）： 电路装置，制造电路装置的方法，装置安装板和半导体模块
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申请号： US12673409申请日： 2008-08-08
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公开(公告)号： US20100264552A1公开(公告)日： 2010-10-21
- 发明人: Mayumi Nakasato , Ryosuke Usui , Yasunori Inoue , Kiyoshi Shibata
- 申请人： Mayumi Nakasato , Ryosuke Usui , Yasunori Inoue , Kiyoshi Shibata
- 优先权： JP2007-210246 20070810; JP2007-254714 20070928
- 国际申请： PCT/JP2008/002186 WO 20080808
- 主分类号： H01L23/488
- IPC分类号： H01L23/488 ; H01L21/60 ; H01L21/56 ; H05K1/00 ; H05K1/11
摘要：
A circuit device includes an insulating base provided with a resin layer mixed with a fibrous filler, bumps provided in the insulating base and functioning as electrodes for connection, a semiconductor device that is flip-chip mounted, and an underfill filling a gap between the semiconductor device and the insulating base. By allowing the fibrous filler projecting through the top surface of the resin layer to be in contact with the underfill, strength of adhesion between the underfill and the insulating base is improved.
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