发明申请
US20100277884A1 CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTION STRUCTURE
审中-公开
电路连接材料和电路端子连接结构
- 专利标题: CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTION STRUCTURE
- 专利标题(中): 电路连接材料和电路端子连接结构
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申请号: US12681456申请日: 2008-09-29
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公开(公告)号: US20100277884A1公开(公告)日: 2010-11-04
- 发明人: Motohiro Arifuku , Kouji Kobayashi , Kazuyoshi Kojima , Nichiomi Mochizuki , Sunao Kudou
- 申请人: Motohiro Arifuku , Kouji Kobayashi , Kazuyoshi Kojima , Nichiomi Mochizuki , Sunao Kudou
- 申请人地址: JP Tokyo
- 专利权人: HITACHI CHEMICAL COMPANY, LTD.
- 当前专利权人: HITACHI CHEMICAL COMPANY, LTD.
- 当前专利权人地址: JP Tokyo
- 优先权: JPP2007-258637 20071002
- 国际申请: PCT/JP2008/067661 WO 20080929
- 主分类号: H05K1/14
- IPC分类号: H05K1/14 ; C08K5/29
摘要:
The circuit-connecting material of the invention is a circuit-connecting material for connection between a first circuit member having a first circuit electrode formed on the main side of a first board, and a second circuit member having a second circuit electrode formed on the main side of a second board, with the first circuit electrode and the second circuit electrode laid facing each other, the circuit-connecting material comprising a film-forming material, a curing agent that generates free radicals upon heating, a radical-polymerizing substance, an isocyanate group-containing compound and a ketimine group-containing compound represented by the following general formula (I), wherein the isocyanate group-containing compound content is 0.1-5 parts by weight and the ketimine group-containing compound content is 0.1-5 parts by weight with respect to 100 parts by weight as the total of the film-forming material and radical-polymerizing substance. Wherein R represents an organic group, R1 and R2 each represent a C1-C4 monovalent aliphatic hydrocarbon group, and R1 and R2 may be linked together to form a cycloalkyl group.