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公开(公告)号：US20100277884A1
公开(公告)日：2010-11-04
申请号：US12681456
申请日：2008-09-29
CPC分类号： H01R4/04 , C08G18/3256 , C08G18/4213 , C08G18/4277 , C08G18/672 , C08G18/718 , C08G18/755 , C08G18/7671 , C08K5/29 , C08L63/00 , C08L75/16 , C08L79/08 , C08L2205/02 , C08L2666/20 , C09J163/00 , C09J175/06 , H05K3/323 , H05K3/361 , C08G18/42
摘要： The circuit-connecting material of the invention is a circuit-connecting material for connection between a first circuit member having a first circuit electrode formed on the main side of a first board, and a second circuit member having a second circuit electrode formed on the main side of a second board, with the first circuit electrode and the second circuit electrode laid facing each other, the circuit-connecting material comprising a film-forming material, a curing agent that generates free radicals upon heating, a radical-polymerizing substance, an isocyanate group-containing compound and a ketimine group-containing compound represented by the following general formula (I), wherein the isocyanate group-containing compound content is 0.1-5 parts by weight and the ketimine group-containing compound content is 0.1-5 parts by weight with respect to 100 parts by weight as the total of the film-forming material and radical-polymerizing substance. Wherein R represents an organic group, R1 and R2 each represent a C1-C4 monovalent aliphatic hydrocarbon group, and R1 and R2 may be linked together to form a cycloalkyl group.
摘要翻译： 本发明的电路连接材料是一种电路连接材料，用于在具有形成在第一板的主侧上的第一电路电极的第一电路部件与形成在主体上的第二电路电极的第二电路部件 第一电路电极和第二电路电极彼此面对，电路连接材料包括成膜材料，加热时产生自由基的固化剂，自由基聚合物质， 含异氰酸酯基的化合物和由以下通式（I）表示的含有酮亚胺基的化合物，其中含异氰酸酯基的化合物含量为0.1-5重量份，含酮亚胺基的化合物含量为0.1-5重量份 相对于成膜材料和自由基聚合物质的总量为100重量份。 其中R表示有机基团，R1和R2各自表示C1-C4单价脂族烃基，R1和R2可以连接在一起形成环烷基。
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公开(公告)号：US20100025097A1
公开(公告)日：2010-02-04
申请号：US12447543
申请日：2007-10-30
IPC分类号： H05K1/14
CPC分类号： H01B1/22 , C08K7/16 , C08K9/02 , C09J9/02 , C09J11/02 , H01L24/05 , H01L24/16 , H01L24/29 , H01L24/81 , H01L25/0657 , H01L2224/0401 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29399 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01067 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/0665 , H01L2924/07811 , H01L2924/10253 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K3/323 , H05K3/361 , H05K2201/0221 , H01L2924/00 , H01L2924/01028 , H01L2924/01026 , H01L2924/01027 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： There is provided a circuit connection structure that can provide satisfactory electrical connection between opposing circuit electrodes and that can sufficiently increase the long-term reliability of electrical characteristics between circuit electrodes. A circuit connection structure 1 comprising a first circuit member 30 having a first circuit electrode 32 formed on the main side 31a of a first circuit board 31, a second circuit member 40 situated opposing the first circuit member 30 and having a second circuit electrode 42 formed on the main side 41a of a second circuit board 41, and a circuit-connecting member 10 provided between the main side of the first circuit member 30 and the main side of the second circuit member 40 and electrically connecting the first and second circuit electrodes 32, 42, characterized in that the thickness of the first and second circuit electrodes 32, 42 is at least 50 nm, the circuit-connecting member 10 is obtained by curing a circuit-connecting material containing an adhesive composition and conductive particles 12 having multiple protrusions 14 on the surface side, and the outermost layer of the conductive particles 12 is composed of nickel or a nickel alloy.
摘要翻译： 提供了一种电路连接结构，其可以在相对的电路电极之间提供令人满意的电连接，并且可以充分增加电路电极之间的电特性的长期可靠性。 电路连接结构1包括第一电路构件30，第一电路构件30具有形成在第一电路板31的主侧31a上的第一电路电极32，与第一电路构件30相对的第二电路构件40，并且形成有第二电路电极42 在第二电路基板41的主面41a和设置在第一电路部件30的主面与第二电路部件40的主面之间并电连接第一和第二电路电极32的电路连接部件10 42，其特征在于，第一和第二电路电极32,42的厚度为至少50nm，电路连接部件10通过固化含有粘合剂组合物的电路连接材料和具有多个突起的导电粒子12而获得 14，导电粒子12的最外层由镍或镍合金构成。
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3.发明申请CIRCUIT CONNECTION MATERIAL, AND CONNECTION STRUCTURE OF CIRCUIT MEMBER AND CONNECTION METHOD OF CIRCUIT MEMBER USING THE CIRCUIT CONNECTION MATERIAL 审中-公开电路连接材料，电路部件的连接结构以及使用电路连接材料的电路连接方法公开(公告)号：US20110267791A1
公开(公告)日：2011-11-03
申请号：US12671804
申请日：2008-07-31
申请人： Katsuhiko Tomisaka , Kouji Kobayashi , Jun Taketatsu , Motohiro Arifuku , Kazuyoshi Kojima , Nichiomi Mochizuki
发明人： Katsuhiko Tomisaka , Kouji Kobayashi , Jun Taketatsu , Motohiro Arifuku , Kazuyoshi Kojima , Nichiomi Mochizuki
CPC分类号： H05K3/323 , C08K7/16 , C08K9/02 , C09J9/02 , C09J11/04 , C09J163/00 , H01L24/29 , H01L24/83 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/13016 , H01L2224/13144 , H01L2224/16 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/2939 , H01L2224/294 , H01L2224/29439 , H01L2224/29447 , H01L2224/29455 , H01L2224/29499 , H01L2224/2989 , H01L2224/81903 , H01L2224/83192 , H01L2224/838 , H01L2224/83851 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01R4/04 , H01R11/01 , H01R12/52 , H01R13/03 , H05K2201/0218 , H05K2201/0221 , Y10T29/49117 , Y10T428/256 , H01L2924/01028 , H01L2924/01026 , H01L2924/3512 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A circuit connection material 10 comprising an adhesive composition 11 and conductive particles 12, wherein the conductive particles 12 are conductive particles 12 with protrusions 14 comprising one or more metal layers 22 on a core 21, with the metal layer 22 being formed on at least surfaces of the protrusions 14 and the metal layer 22 being composed of nickel or a nickel alloy, and compression modulus of the conductive particles 12 under 20% compression is 100-800 kgf/mm2.
摘要翻译： 包括粘合剂组合物11和导电颗粒12的电路连接材料10，其中导电颗粒12是导电颗粒12，其中凸起14包括在芯21上的一个或多个金属层22，金属层22形成在至少表面 的突起14和金属层22由镍或镍合金构成，导电粒子12在20％压缩下的压缩模量为100-800kgf / mm2。
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4.发明申请公开(公告)号：US20100139947A1
公开(公告)日：2010-06-10
申请号：US12600181
申请日：2008-05-14
CPC分类号： H05K3/323 , C08K7/16 , C08K9/02 , C09J9/02 , C09J11/02 , H01B1/02 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05669 , H01L2224/05671 , H01L2224/13016 , H01L2224/16 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29355 , H01L2224/2939 , H01L2224/294 , H01L2224/29499 , H01L2224/2989 , H01L2224/81903 , H01L2224/838 , H01L2224/83851 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/10253 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01R4/04 , H01R12/714 , H01R13/03 , H05K3/361 , H05K2201/0221 , Y10T428/2998 , H01L2924/01028 , H01L2924/01026 , H01L2924/3512 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A circuit-connecting material for electrical connection of two circuit members with circuit electrodes formed thereon, with the circuit electrodes opposing, wherein the circuit-connecting material comprises an adhesive composition and conductive particles, and the conductive particles are conductive particles having a plurality of protrusions on the surface and consisting of a core made of an organic high molecular compound covered with a metal layer composed of nickel or a nickel alloy, the mean particle size of the core being 1-4 μm and the thickness of the metal layer being 65-125 nm.
摘要翻译： 一种电路连接材料，用于将两个电路元件与其上形成有电路电极的电连接，其中电路电极相对，其中电路连接材料包括粘合剂组合物和导电颗粒，并且导电颗粒是具有多个突起 由表面上由由镍或镍合金构成的金属层覆盖的有机高分子化合物构成的芯构成，芯的平均粒径为1-4μm，金属层的厚度为65〜 125 nm。
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5.发明申请CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD OF CONNECTING CIRCUIT MEMBER 有权电路连接材料，电路部件连接结构及连接电路部件的方法公开(公告)号：US20100208444A1
公开(公告)日：2010-08-19
申请号：US12769925
申请日：2010-04-29
申请人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
发明人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
IPC分类号： H05K1/11 , H01B1/20 , C09J175/04
CPC分类号： H05K3/323 , C08G18/4213 , C08G18/672 , C08L75/06 , C08L2666/20 , C09J175/16 , H01R12/52 , H05K3/361 , Y10T29/49126 , C08G18/42
摘要： The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group.
摘要翻译： 用于连接电路构件的电路连接材料，每个电路构件具有形成在基板的主表面上的基板和电路电极，包括响应于光或热而固化的粘合剂组合物和含有氨基甲酸酯基团和酯的有机化合物 组。
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6.发明授权Circuit connection material, circuit member connecting structure and method of connecting circuit member 有权电路连接材料，电路构件的连接结构和连接电路构件的方法公开(公告)号：US08558118B2
公开(公告)日：2013-10-15
申请号：US12769953
申请日：2010-04-29
申请人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
发明人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
CPC分类号： H05K3/323 , C08G18/4213 , C08G18/672 , C08L75/06 , C08L2666/20 , C09J175/16 , H01R12/52 , H05K3/361 , Y10T29/49126 , C08G18/42
摘要： The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group.
摘要翻译： 用于连接电路构件的电路连接材料，每个电路构件具有形成在基板的主表面上的基板和电路电极，包括响应于光或热而固化的粘合剂组合物和含有氨基甲酸酯基团和酯的有机化合物 组。
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公开(公告)号：US20100108365A1
公开(公告)日：2010-05-06
申请号：US12374628
申请日：2006-07-21
申请人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
发明人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
IPC分类号： H05K1/09 , C08K5/29 , C09J133/12
CPC分类号： H05K3/323 , C08G18/4213 , C08G18/672 , C08L75/06 , C08L2666/20 , C09J175/16 , H01R12/52 , H05K3/361 , Y10T29/49126 , C08G18/42
摘要： The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group.
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公开(公告)号：US08541688B2
公开(公告)日：2013-09-24
申请号：US12769925
申请日：2010-04-29
申请人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
发明人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
CPC分类号： H05K3/323 , C08G18/4213 , C08G18/672 , C08L75/06 , C08L2666/20 , C09J175/16 , H01R12/52 , H05K3/361 , Y10T29/49126 , C08G18/42
摘要： The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group.
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公开(公告)号：US20100212943A1
公开(公告)日：2010-08-26
申请号：US12769953
申请日：2010-04-29
申请人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
发明人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
CPC分类号： H05K3/323 , C08G18/4213 , C08G18/672 , C08L75/06 , C08L2666/20 , C09J175/16 , H01R12/52 , H05K3/361 , Y10T29/49126 , C08G18/42
摘要： The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group.
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10.发明授权公开(公告)号：US08497431B2
公开(公告)日：2013-07-30
申请号：US12374628
申请日：2006-07-21
申请人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
发明人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
CPC分类号： H05K3/323 , C08G18/4213 , C08G18/672 , C08L75/06 , C08L2666/20 , C09J175/16 , H01R12/52 , H05K3/361 , Y10T29/49126 , C08G18/42
摘要： The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group.
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