CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTION STRUCTURE
    10.
    发明申请
    CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTION STRUCTURE 审中-公开
    电路连接材料和电路端子连接结构

    公开(公告)号:US20100277884A1

    公开(公告)日:2010-11-04

    申请号:US12681456

    申请日:2008-09-29

    IPC分类号: H05K1/14 C08K5/29

    摘要: The circuit-connecting material of the invention is a circuit-connecting material for connection between a first circuit member having a first circuit electrode formed on the main side of a first board, and a second circuit member having a second circuit electrode formed on the main side of a second board, with the first circuit electrode and the second circuit electrode laid facing each other, the circuit-connecting material comprising a film-forming material, a curing agent that generates free radicals upon heating, a radical-polymerizing substance, an isocyanate group-containing compound and a ketimine group-containing compound represented by the following general formula (I), wherein the isocyanate group-containing compound content is 0.1-5 parts by weight and the ketimine group-containing compound content is 0.1-5 parts by weight with respect to 100 parts by weight as the total of the film-forming material and radical-polymerizing substance. Wherein R represents an organic group, R1 and R2 each represent a C1-C4 monovalent aliphatic hydrocarbon group, and R1 and R2 may be linked together to form a cycloalkyl group.

    摘要翻译: 本发明的电路连接材料是一种电路连接材料,用于在具有形成在第一板的主侧上的第一电路电极的第一电路部件与形成在主体上的第二电路电极的第二电路部件 第一电路电极和第二电路电极彼此面对,电路连接材料包括成膜材料,加热时产生自由基的固化剂,自由基聚合物质, 含异氰酸酯基的化合物和由以下通式(I)表示的含有酮亚胺基的化合物,其中含异氰酸酯基的化合物含量为0.1-5重量份,含酮亚胺基的化合物含量为0.1-5重量份 相对于成膜材料和自由基聚合物质的总量为100重量份。 其中R表示有机基团,R1和R2各自表示C1-C4单价脂族烃基,R1和R2可以连接在一起形成环烷基。