发明申请
US20100279020A1 METHOD OF FORMING IN-SITU PRE-GaN DEPOSITION LAYER IN HVPE
审中-公开
在HVPE中形成原位前置GaN沉积层的方法
- 专利标题: METHOD OF FORMING IN-SITU PRE-GaN DEPOSITION LAYER IN HVPE
- 专利标题(中): 在HVPE中形成原位前置GaN沉积层的方法
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申请号: US12770306申请日: 2010-04-29
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公开(公告)号: US20100279020A1公开(公告)日: 2010-11-04
- 发明人: Yuriy Melnik , Hidehiro Kojiri , Olga Kryliouk , Tetsuya Ishikawa
- 申请人: Yuriy Melnik , Hidehiro Kojiri , Olga Kryliouk , Tetsuya Ishikawa
- 申请人地址: US CA Santa Clara
- 专利权人: APPLIED MATERIALS, INC.
- 当前专利权人: APPLIED MATERIALS, INC.
- 当前专利权人地址: US CA Santa Clara
- 主分类号: B05D1/36
- IPC分类号: B05D1/36
摘要:
A method and apparatus is provided for preparing a substrate for forming electronic devices incorporating III/V compound semiconductors. Elemental halogen gases, hydrogen halide gases, or other halogen or halide gases, are contacted with liquid or solid group III metals to form precursors which are reacted with nitrogen sources to deposit a nitride buffer layer on the substrate. The buffer layer, which may be a transition layer, may incorporate more than one group III metal, and may be deposited with amorphous or crystalline morphology. An amorphous layer may be partially or fully recrystallized by thermal treatment. Instead of a layer, a plurality of discrete nucleation sites may be formed, whose size, density, and distribution may be controlled. The nitrogen source may include reactive nitrogen compounds as well as active nitrogen from a remote plasma source. The composition of the buffer or transition layer may also vary with depth according to a desired profile.
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