发明申请
US20100283026A1 NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF 有权
非易失性半导体存储器件及其制造方法

NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
摘要:
A first wire layer (19) including first memory wires (12) is connected to a second wire layer (20) including second memory wires (17) via first contacts (21) penetrating a first interlayer insulating layer (13). The first wire layer (13) is connected to and led out to upper wires (22) via second contacts (26) connected to the second wire layer (20) and penetrating the second interlayer insulating layer (18). The first contacts (21) penetrate semiconductor layer (17b) or insulator layer (17c) of the second wire layer (20).
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