发明申请
- 专利标题： Array Substrate and Method for Fabricating Thereof
- 专利标题（中）： 阵列基板及其制造方法
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申请号： US12837787申请日： 2010-07-16
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公开(公告)号： US20100285623A1公开(公告)日： 2010-11-11
- 发明人: Chih-Hung Shih , Ming-Yuan Huang , Chih-Chun Yang
- 申请人： Chih-Hung Shih , Ming-Yuan Huang , Chih-Chun Yang
- 申请人地址： TW Hsinchu
- 专利权人： AU Optronics Corp.
- 当前专利权人： AU Optronics Corp.
- 当前专利权人地址： TW Hsinchu
- 优先权： TW95126510 20060720
- 主分类号： H01L21/28
- IPC分类号： H01L21/28
摘要：
The invention provides a method for manufacturing an array substrate utilizing a laser ablation process. A conductive layer can be selectively patterned by the laser ablation process without a photo mask due to different adhesions between the conductive layer and other materials. The patterned conductive layer thus formed adjoins an inorganic passivation layer to provide a substantially continuous surface.
公开/授权文献
- US08012815B2 Array substrate and method for fabricating thereof 公开/授权日：2011-09-06
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