发明申请
US20100289005A1 AMORPHOUS MULTI-COMPONENT METALLIC THIN FILMS FOR ELECTRONIC DEVICES
有权
用于电子设备的非均匀多组分金属薄膜
- 专利标题： AMORPHOUS MULTI-COMPONENT METALLIC THIN FILMS FOR ELECTRONIC DEVICES
- 专利标题（中）： 用于电子设备的非均匀多组分金属薄膜
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申请号： US12777194申请日： 2010-05-10
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公开(公告)号： US20100289005A1公开(公告)日： 2010-11-18
- 发明人: E. William Cowell, III , John F. Wager , Brady J. Gibbons , Douglas A. Keszler
- 申请人： E. William Cowell, III , John F. Wager , Brady J. Gibbons , Douglas A. Keszler
- 专利权人： The State of Oregon acting by and through the State Board of Higher Education on behalf of,Oregon State University
- 当前专利权人： The State of Oregon acting by and through the State Board of Higher Education on behalf of,Oregon State University
- 主分类号： H01L29/72
- IPC分类号： H01L29/72 ; H01L29/861 ; H01L21/02
摘要：
An electronic structure comprising: (a) a first metal layer; (b) a second metal layer; (c) and at least one insulator layer located between the first metal layer and the second metal layer, wherein at least one of the metal layers comprises an amorphous multi-component metallic film. In certain embodiments, the construct is a metal-insulator-metal (MIM) diode.
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