发明申请
- 专利标题: Chip Pickup Method and Chip Pickup Apparatus
- 专利标题(中): 芯片拾取方法和芯片拾取装置
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申请号: US12445689申请日: 2007-10-12
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公开(公告)号: US20100289283A1公开(公告)日: 2010-11-18
- 发明人: Kenichi Watanabe , Takeshi Segawa , Hironobu Fujimoto
- 申请人: Kenichi Watanabe , Takeshi Segawa , Hironobu Fujimoto
- 申请人地址: JP Tokyo
- 专利权人: LINTEC CORPORATION
- 当前专利权人: LINTEC CORPORATION
- 当前专利权人地址: JP Tokyo
- 优先权: JP2006-283983 20061018
- 国际申请: PCT/JP2007/070009 WO 20071012
- 主分类号: B25J15/06
- IPC分类号: B25J15/06 ; H01L21/683
摘要:
A method is provided for picking up a chip 13 from a fixing jig 3 to which the chip 13 is fixed. The fixing jig 3 consists of a jig base 30 having a plurality of protrusions 36 on one side and a sidewall 35 having a height almost equivalent to that of the protrusion 36 at the outer circumference of the one side, and an contact layer 31 that is laminated on the surface of the jig base 30 having the protrusions 36 and that is bonded on the upper surface of the sidewall 35. A section space 37 is formed on the surface of the jig base 30 having the protrusions by the contact layer 31, the protrusions 36 and the sidewall 35, and at least one through hole 38 penetrating the outside and the section space 37 is provided in the jig base 30. The pickup method comprises the steps of fixing a chip, deforming the contact layer 31 by suctioning of air in the section space 37 through the through hole 38, and picking up the chip 13 completely from the contact layer 31 by suctioning the chip 13 from the upper surface side of the chip 13 by means of a suction collet 70.
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