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    Fixed jig, chip pickup method and chip pickup apparatus
    1.
    发明授权
    Fixed jig, chip pickup method and chip pickup apparatus 有权
    固定夹具，芯片拾取方法和芯片拾取装置

    公开(公告)号：US08182649B2

    公开(公告)日：2012-05-22

    申请号：US12445697

    申请日：2007-10-12

    申请人： Kenichi Watanabe ,  Takeshi Segawa ,  Hironobu Fujimoto

    发明人： Kenichi Watanabe ,  Takeshi Segawa ,  Hironobu Fujimoto

    IPC分类号： B32B38/10

    CPC分类号： H01L21/6838 ,  H01L21/67132 ,  Y10S156/941 ,  Y10T156/1132 ,  Y10T156/1168 ,  Y10T156/1944 ,  Y10T156/1978

    摘要： It is an object to provide a fixing jig which can unmovably suction a chip group produced by segmenting a semiconductor wafer into pieces, and can suction one chip by detaching the chip selectively and reliably from the chip group. A fixing jig 3 is composed of a jig base 30 and an contact layer 31. A concave part 2 is formed on one side of the jig base 30. The concave part 2 is sectioned into small chambers 15 by a partition 12 having a height almost equivalent to that of a sidewall 35. The contact layer 31 is disposed on the upper edge of the sidewall 35 and the partition 12 for covering the concave part 2. A through hole 17 that is communicated with the outside is formed in each small chamber 15.

    摘要翻译： 本发明的目的是提供一种固定夹具，其可以将通过将半导体晶片分割成片而产生的芯片组不可移动地吸引，并且可以通过从芯片组中选择性且可靠地分离芯片来吸引一个芯片。 固定夹具3由夹具基座30和接触层31构成。凹部2形成在夹具基座30的一侧。凹部2由高度几乎为几厘米的隔板12分割成小室15 接触层31设置在侧壁35的上边缘和用于覆盖凹部2的隔壁12上。在每个小室15中形成有与外部连通的通孔17 。

    Fixed Jig, Chip Pickup Method and Chip Pickup Apparatus
    2.
    发明申请
    Fixed Jig, Chip Pickup Method and Chip Pickup Apparatus 有权
    固定夹具，芯片拾取方法和芯片拾取装置

    公开(公告)号：US20100314894A1

    公开(公告)日：2010-12-16

    申请号：US12445697

    申请日：2007-10-12

    申请人： Kenichi Watanabe ,  Takeshi Segawa ,  Hironobu Fujimoto

    发明人： Kenichi Watanabe ,  Takeshi Segawa ,  Hironobu Fujimoto

    IPC分类号： H01L21/67 ,  B25J15/06 ,  B66C1/02 ,  F16M13/00 ,  H01L21/683

    CPC分类号： H01L21/6838 ,  H01L21/67132 ,  Y10S156/941 ,  Y10T156/1132 ,  Y10T156/1168 ,  Y10T156/1944 ,  Y10T156/1978

    摘要： It is an object to provide a fixing jig which can unmovably suction a chip group produced by segmenting a semiconductor wafer into pieces, and can suction one chip by detaching the chip selectively and reliably from the chip group. A fixing jig 3 is composed of a jig base 30 and an contact layer 31. A concave part 2 is formed on one side of the jig base 30. The concave part 2 is sectioned into small chambers 15 by a partition 12 having a height almost equivalent to that of a sidewall 35. The contact layer 31 is disposed on the upper edge of the sidewall 35 and the partition 12 for covering the concave part 2. A through hole 17 that is communicated with the outside is formed in each small chamber 15.

    摘要翻译： 本发明的目的是提供一种固定夹具，其可以将通过将半导体晶片分割成片而产生的芯片组不可移动地吸引，并且可以通过从芯片组中选择性且可靠地分离芯片来吸引一个芯片。 固定夹具3由夹具基座30和接触层31构成。凹部2形成在夹具基座30的一侧。凹部2由高度几乎为几厘米的隔板12分割成小室15 接触层31设置在侧壁35的上边缘和用于覆盖凹部2的隔壁12上。在每个小室15中形成有与外部连通的通孔17 。

    Chip Pickup Method and Chip Pickup Apparatus
    3.
    发明申请
    Chip Pickup Method and Chip Pickup Apparatus 审中-公开
    芯片拾取方法和芯片拾取装置

    公开(公告)号：US20100289283A1

    公开(公告)日：2010-11-18

    申请号：US12445689

    申请日：2007-10-12

    申请人： Kenichi Watanabe ,  Takeshi Segawa ,  Hironobu Fujimoto

    发明人： Kenichi Watanabe ,  Takeshi Segawa ,  Hironobu Fujimoto

    IPC分类号： B25J15/06 ,  H01L21/683

    CPC分类号： H01L21/67132 ,  H01L21/6838

    摘要： A method is provided for picking up a chip 13 from a fixing jig 3 to which the chip 13 is fixed. The fixing jig 3 consists of a jig base 30 having a plurality of protrusions 36 on one side and a sidewall 35 having a height almost equivalent to that of the protrusion 36 at the outer circumference of the one side, and an contact layer 31 that is laminated on the surface of the jig base 30 having the protrusions 36 and that is bonded on the upper surface of the sidewall 35. A section space 37 is formed on the surface of the jig base 30 having the protrusions by the contact layer 31, the protrusions 36 and the sidewall 35, and at least one through hole 38 penetrating the outside and the section space 37 is provided in the jig base 30. The pickup method comprises the steps of fixing a chip, deforming the contact layer 31 by suctioning of air in the section space 37 through the through hole 38, and picking up the chip 13 completely from the contact layer 31 by suctioning the chip 13 from the upper surface side of the chip 13 by means of a suction collet 70.

    摘要翻译： 提供了一种用于从固定夹具3拾取芯片13的方法，固定夹具3固定芯片13。 固定夹具3由在一侧具有多个突起36的夹具基座30和具有与一侧的外周的突起36的高度几乎相同的高度的侧壁35以及接触层31 层压在具有突起36的夹具基座30的表面上并且接合在侧壁35的上表面上。在具有突起的夹具基座30的表面上通过接触层31形成截面空间37， 突起36和侧壁35以及贯穿外部的至少一个通孔38，并且在夹具基座30中设置有截面空间37.拾取方法包括如下步骤：固定芯片，通过抽吸空气使接触层31变形 在截面空间37中通过通孔38，并且通过吸力夹头70从芯片13的上表面侧抽吸芯片13，完全从接触层31拾取芯片13。

    HOLDING JIG, SEMICONDUCTOR WAFER GRINDING METHOD, SEMICONDUCTOR WAFER PROTECTING STRUCTURE AND SEMICONDUCTOR WAFER GRINDING METHOD AND SEMICONDUCTOR CHIP FABRICATION METHOD USING THE STRUCTURE
    4.
    发明申请
    HOLDING JIG, SEMICONDUCTOR WAFER GRINDING METHOD, SEMICONDUCTOR WAFER PROTECTING STRUCTURE AND SEMICONDUCTOR WAFER GRINDING METHOD AND SEMICONDUCTOR CHIP FABRICATION METHOD USING THE STRUCTURE 有权
    控制晶圆，半导体晶粒磨削方法，半导体晶体保护结构和半导体晶粒研磨方法及半导体芯片制造方法

    公开(公告)号：US20090081852A1

    公开(公告)日：2009-03-26

    申请号：US12282984

    申请日：2007-03-09

    申请人： Kiyofumi Tanaka ,  Satoshi Odashima ,  Noriyoshi Hosono ,  Hironobu Fujimoto ,  Takeshi Segawa

    发明人： Kiyofumi Tanaka ,  Satoshi Odashima ,  Noriyoshi Hosono ,  Hironobu Fujimoto ,  Takeshi Segawa

    IPC分类号： H01L21/304 ,  B24B41/06

    CPC分类号： H01L21/6875 ,  B24B37/042 ,  B24B41/061 ,  B65G49/061 ,  B65G2249/045 ,  Y10T428/24322

    摘要： A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for performing a grinding process of the rear side of semiconductor wafer W held by holding jig 20; and a washing device 40 for ground semiconductor wafers W. Each holding jig 20 is constructed of a concave 22 depressed on the surface of a base plate 21, a multiple number of supporting projections 23 projectively arrayed on the bottom surface of concave 22, a deformable contact film 24, covering the concave 22, being supported by the multiple supporting projections 23, for detachably holding semiconductor wafer W in close contact with it; and an exhaust path 25 for conducting air from the concave 22 covered by contact film 24 to the outside.

    摘要翻译： 半导体晶片W的背面研磨机10包括：设置在安装件11的工作面上的工作台13; 通过表13上的检查台15布置多个保持夹具20; 用于进行通过保持夹具20保持的半导体晶片W的后侧的研磨处理的研磨机30; 以及用于接地半导体晶片W的洗涤装置40.每个保持夹具20由在基板21的表面上凹陷的凹部22构成，多个支撑突起23投影地排列在凹部22的底面上， 接触膜24，覆盖凹部22，由多个支撑突起23支撑，用于可拆卸地保持半导体晶片W与其紧密接触; 以及用于将空气从由接触膜24覆盖的凹部22引导到外部的排气路径25。

    Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure
    5.
    发明授权
    Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure 有权
    保持夹具，半导体晶片研磨方法，半导体晶片保护结构和半导体晶片研磨方法以及使用该结构的半导体芯片制造方法

    公开(公告)号：US08212345B2

    公开(公告)日：2012-07-03

    申请号：US12945078

    申请日：2010-11-12

    申请人： Kiyofumi Tanaka ,  Satoshi Odashima ,  Noriyoshi Hosono ,  Hironobu Fujimoto ,  Takeshi Segawa

    发明人： Kiyofumi Tanaka ,  Satoshi Odashima ,  Noriyoshi Hosono ,  Hironobu Fujimoto ,  Takeshi Segawa

    IPC分类号： H01L23/02

    CPC分类号： H01L21/6875 ,  B24B37/042 ,  B24B41/061 ,  B65G49/061 ,  B65G2249/045 ,  Y10T428/24322

    摘要： A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for performing a grinding process of the rear side of semiconductor wafer W held by holding jig 20; and a washing device 40 for ground semiconductor wafers W. Each holding jig 20 is constructed of a concave 22 depressed on the surface of a base plate 21, a multiple number of supporting projections 23 projectively arrayed on the bottom surface of concave 22, a deformable contact film 24, covering the concave 22, being supported by the multiple supporting projections 23, for detachably holding semiconductor wafer W in close contact with it; and an exhaust path 25 for conducting air from the concave 22 covered by contact film 24 to the outside.

    摘要翻译： 半导体晶片W的背面研磨机10包括：设置在安装件11的工作面上的工作台13; 通过表13上的检查台15布置多个保持夹具20; 用于进行通过保持夹具20保持的半导体晶片W的后侧的研磨处理的研磨机30; 以及用于接地半导体晶片W的洗涤装置40.每个保持夹具20由在基板21的表面上凹陷的凹部22构成，多个支撑突起23投影地排列在凹部22的底面上， 接触膜24，覆盖凹部22，由多个支撑突起23支撑，用于可拆卸地保持半导体晶片W与其紧密接触; 以及用于将空气从由接触膜24覆盖的凹部22引导到外部的排气路径25。

    HOLDING JIG, SEMICONDUCTOR WAFER GRINDING METHOD, SEMICONDUCTOR WAFER PROTECTING STRUCTURE AND SEMICONDUCTOR WAFER GRINDING METHOD AND SEMICONDUCTOR CHIP FABRICATION METHOD USING THE STRUCTURE
    6.
    发明申请
    HOLDING JIG, SEMICONDUCTOR WAFER GRINDING METHOD, SEMICONDUCTOR WAFER PROTECTING STRUCTURE AND SEMICONDUCTOR WAFER GRINDING METHOD AND SEMICONDUCTOR CHIP FABRICATION METHOD USING THE STRUCTURE 有权
    控制晶圆，半导体晶粒磨削方法，半导体晶体保护结构和半导体晶粒研磨方法及半导体芯片制造方法

    公开(公告)号：US20110281509A1

    公开(公告)日：2011-11-17

    申请号：US12945078

    申请日：2010-11-12

    申请人： KIYOFUMI TANAKA ,  Satoshi Odashima ,  Noriyoshi Hosono ,  Hironobu Fujimoto ,  Takeshi Segawa

    发明人： KIYOFUMI TANAKA ,  Satoshi Odashima ,  Noriyoshi Hosono ,  Hironobu Fujimoto ,  Takeshi Segawa

    IPC分类号： H01L21/304 ,  B24B41/06

    CPC分类号： H01L21/6875 ,  B24B37/042 ,  B24B41/061 ,  B65G49/061 ,  B65G2249/045 ,  Y10T428/24322

    摘要： A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for performing a grinding process of the rear side of semiconductor wafer W held by holding jig 20; and a washing device 40 for ground semiconductor wafers W. Each holding jig 20 is constructed of a concave 22 depressed on the surface of a base plate 21, a multiple number of supporting projections 23 projectively arrayed on the bottom surface of concave 22, a deformable contact film 24, covering the concave 22, being supported by the multiple supporting projections 23, for detachably holding semiconductor wafer W in close contact with it; and an exhaust path 25 for conducting air from the concave 22 covered by contact film 24 to the outside.

    摘要翻译： 半导体晶片W的背面研磨机10包括：设置在安装件11的工作面上的工作台13; 通过表13上的检查台15布置多个保持夹具20; 用于进行通过保持夹具20保持的半导体晶片W的后侧的研磨处理的研磨机30; 以及用于接地半导体晶片W的洗涤装置40.每个保持夹具20由在基板21的表面上凹陷的凹部22构成，多个支撑突起23投影地排列在凹部22的底面上， 接触膜24，覆盖凹部22，由多个支撑突起23支撑，用于可拆卸地保持半导体晶片W与其紧密接触; 以及用于将空气从由接触膜24覆盖的凹部22引导到外部的排气路径25。

    Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure
    7.
    发明授权
    Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure 有权
    保持夹具，半导体晶片研磨方法，半导体晶片保护结构和半导体晶片研磨方法以及使用该结构的半导体芯片制造方法

    公开(公告)号：US07875501B2

    公开(公告)日：2011-01-25

    申请号：US12282984

    申请日：2007-03-09

    申请人： Kiyofumi Tanaka ,  Satoshi Odashima ,  Noriyoshi Hosono ,  Hironobu Fujimoto ,  Takeshi Segawa

    发明人： Kiyofumi Tanaka ,  Satoshi Odashima ,  Noriyoshi Hosono ,  Hironobu Fujimoto ,  Takeshi Segawa

    IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

    CPC分类号： H01L21/6875 ,  B24B37/042 ,  B24B41/061 ,  B65G49/061 ,  B65G2249/045 ,  Y10T428/24322

    摘要： A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for performing a grinding process of the rear side of semiconductor wafer W held by holding jig 20; and a washing device 40 for ground semiconductor wafers W. Each holding jig 20 is constructed of a concave 22 depressed on the surface of a base plate 21, a multiple number of supporting projections 23 projectively arrayed on the bottom surface of concave 22, a deformable contact film 24, covering the concave 22, being supported by the multiple supporting projections 23, for detachably holding semiconductor wafer W in close contact with it; and an exhaust path 25 for conducting air from the concave 22 covered by contact film 24 to the outside.

    摘要翻译： 半导体晶片W的背面研磨机10包括：设置在安装件11的工作面上的工作台13; 通过表13上的检查台15布置多个保持夹具20; 用于进行通过保持夹具20保持的半导体晶片W的后侧的研磨处理的研磨机30; 以及用于接地半导体晶片W的洗涤装置40.每个保持夹具20由在基板21的表面上凹陷的凹部22构成，多个支撑突起23投影地排列在凹部22的底面上， 接触膜24，覆盖凹部22，由多个支撑突起23支撑，用于可拆卸地保持半导体晶片W与其紧密接触; 以及用于将空气从由接触膜24覆盖的凹部22引导到外部的排气路径25。