发明申请
US20100308409A1 FINFET STRUCTURES WITH FINS HAVING STRESS-INDUCING CAPS AND METHODS FOR FABRICATING THE SAME
审中-公开
具有应力诱导颗粒的FINS的FINFET结构及其制造方法
- 专利标题: FINFET STRUCTURES WITH FINS HAVING STRESS-INDUCING CAPS AND METHODS FOR FABRICATING THE SAME
- 专利标题(中): 具有应力诱导颗粒的FINS的FINFET结构及其制造方法
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申请号: US12480263申请日: 2009-06-08
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公开(公告)号: US20100308409A1公开(公告)日: 2010-12-09
- 发明人: Frank S. Johnson , Scott Luning , Michael J. Hargrove
- 申请人: Frank S. Johnson , Scott Luning , Michael J. Hargrove
- 申请人地址: KY Grand Cayman
- 专利权人: GLOBALFOUNDRIES INC.
- 当前专利权人: GLOBALFOUNDRIES INC.
- 当前专利权人地址: KY Grand Cayman
- 主分类号: H01L27/088
- IPC分类号: H01L27/088 ; H01L21/308 ; H01L21/31 ; H01L21/8234
摘要:
FinFET structures with fins having stress-inducing caps and methods for fabricating such FinFET structures are provided. In an exemplary embodiment, a method for forming stressed structures comprises forming a first stress-inducing material overlying a semiconductor material and forming spacers overlying the first stress-inducing material. The first stress-inducing material is etched using the spacers as an etch mask to form a plurality of first stress-inducing caps. The semiconductor material is etched using the plurality of first stress-inducing caps as an etch mask.
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