发明申请
- 专利标题： HIGH HOLE MOBILITY P-CHANNEL GE TRANSISTOR STRUCTURE ON SI SUBSTRATE
- 专利标题（中）： 基板上的高孔移动通道晶体管结构
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申请号： US12876922申请日： 2010-09-07
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公开(公告)号： US20100327261A1公开(公告)日： 2010-12-30
- 发明人: Mantu K. Hudait , Suman Datta , Jack T. Kavalieros , Peter G. Tolchinsky
- 申请人： Mantu K. Hudait , Suman Datta , Jack T. Kavalieros , Peter G. Tolchinsky
- 申请人地址： US CA Santa Clara
- 专利权人： INTEL CORPORATION
- 当前专利权人： INTEL CORPORATION
- 当前专利权人地址： US CA Santa Clara
- 主分类号： H01L29/775
- IPC分类号： H01L29/775 ; H01L29/20
摘要：
The present disclosure provides an apparatus and method for implementing a high hole mobility p-channel Germanium (“Ge”) transistor structure on a Silicon (“Si”) substrate. One exemplary apparatus may include a buffer layer including a GaAs nucleation layer, a first GaAs buffer layer, and a second GaAs buffer layer. The exemplary apparatus may further include a bottom barrier on the second GaAs buffer layer and having a band gap greater than 1.1 eV, a Ge active channel layer on the bottom barrier and having a valence band offset relative to the bottom barrier that is greater than 0.3 eV, and an AlAs top barrier on the Ge active channel layer wherein the AlAs top barrier has a band gap greater than 1.1 eV. Of course, many alternatives, variations and modifications are possible without departing from this embodiment.