发明申请
- 专利标题: CURABLE RESIN COMPOSITION AND CURED RESIN
- 专利标题(中): 可固化树脂组合物和固化树脂
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申请号: US12867797申请日: 2009-02-12
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公开(公告)号: US20110003947A1公开(公告)日: 2011-01-06
- 发明人: Hajime Kishi , Yumi Kunimitsu , Jin Imade , Shinya Oshita , Yoshihiro Morishita , Mitsunori Asada
- 申请人: Hajime Kishi , Yumi Kunimitsu , Jin Imade , Shinya Oshita , Yoshihiro Morishita , Mitsunori Asada
- 申请人地址: JP Kurashiki-shi
- 专利权人: Kuraray Co., Ltd.
- 当前专利权人: Kuraray Co., Ltd.
- 当前专利权人地址: JP Kurashiki-shi
- 优先权: JP2008-034333 20080215; JP2008-185529 20080717
- 国际申请: PCT/JP09/52280 WO 20090212
- 主分类号: C08L53/00
- IPC分类号: C08L53/00
摘要:
[Object] A curable epoxy resin composition is provided which is excellent in toughness, is hardly fractured, is strongly adhered to another material, and is also excellent in weather resistance, chemical resistance, and the like while maintaining excellent heat resistance, elastic modulus, and the like inherent to an epoxy resin.[Solution] A curable resin composition contains, with respect to 100 parts of an epoxy resin, 1 to 70 pars of an epoxy resin curing agent and 1 to 50 parts of an acrylic block copolymer, and the acrylic block copolymer contains (α) at least one polymer block A composed of a structural unit derived from an alkyl methacrylate and at least one polymer block B composed of a structural unit derived from an alkyl acrylate, has a weight average molecular weight (Mw) of 30,000 to 300,000 and a molecular weight distribution (Mw/Mn) of 1.5 or less, and contains 3 to 60 percent by mass of the polymer block A. In addition, a cured resin is formed from the above curable resin composition.
公开/授权文献
- US08697811B2 Curable resin composition and cured resin 公开/授权日:2014-04-15
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