发明申请
US20110005010A1 SYSTEM AND METHOD FOR REMOVING PARTICLES IN SEMICONDUCTOR MANUFACTURING
有权
用于在半导体制造中去除颗粒的系统和方法
- 专利标题： SYSTEM AND METHOD FOR REMOVING PARTICLES IN SEMICONDUCTOR MANUFACTURING
- 专利标题（中）： 用于在半导体制造中去除颗粒的系统和方法
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申请号： US12885630申请日： 2010-09-20
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公开(公告)号： US20110005010A1公开(公告)日： 2011-01-13
- 发明人: Chen-Yuan Hsia , Chang-Cheng Hung , Chi-Lun Lu , Shih-Ming Chang , Wen-Chuan Wang , Yen-Bin Huang , Ching-Yu Chang , Chin-Hsiang Lin
- 申请人： Chen-Yuan Hsia , Chang-Cheng Hung , Chi-Lun Lu , Shih-Ming Chang , Wen-Chuan Wang , Yen-Bin Huang , Ching-Yu Chang , Chin-Hsiang Lin
- 申请人地址： TW Hsin-Chu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： A47L13/40
- IPC分类号： A47L13/40
摘要：
A system for semiconductor wafer manufacturing, comprises a chamber process path for processing the wafer, and a device operable to remove particles from the wafer by electrostatic and electromagnetic methodologies wherein the device is installed in the chamber process path.
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