发明申请
- 专利标题： PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- 专利标题（中）： 印刷电路板及其制造方法
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申请号： US12837543申请日： 2010-07-16
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公开(公告)号： US20110011626A1公开(公告)日： 2011-01-20
- 发明人: Daisuke YAMAUCHI , Tetsuya OOSAWA , Mitsuru HONJO , Masami INOUE
- 申请人： Daisuke YAMAUCHI , Tetsuya OOSAWA , Mitsuru HONJO , Masami INOUE
- 申请人地址： JP Osaka
- 专利权人： NITTO DENKO CORPORATION
- 当前专利权人： NITTO DENKO CORPORATION
- 当前专利权人地址： JP Osaka
- 优先权： JP2009-169328 20090717; JP2009-170960 20090722
- 主分类号： H05K1/00
- IPC分类号： H05K1/00 ; H05K3/36
摘要：
A base insulating layer is formed on a suspension body. A lead wire for plating and a wiring trace are integrally formed on the base insulating layer. A cover insulating layer is formed on the base insulating layer to cover the lead wire for plating and the wiring trace. A thickness of a portion of the cover insulating layer above a region of the base insulating layer in which the lead wire for plating is formed is set smaller than the thickness of a portion of the cover insulating layer above other regions of the base insulating layer.
公开/授权文献
- US08853546B2 Printed circuit board and method of manufacturing the same 公开/授权日：2014-10-07
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