发明申请
- 专利标题： SEMICONDUCTOR PACKAGE WITH A STIFFENING MEMBER SUPPORTING A THERMAL HEAT SPREADER
- 专利标题（中）： 具有支撑热传递器的加强构件的半导体封装
-
申请号： US12507049申请日： 2009-07-21
-
公开(公告)号： US20110018125A1公开(公告)日： 2011-01-27
- 发明人: Kum-Weng Loo , Jing-En Luan
- 申请人： Kum-Weng Loo , Jing-En Luan
- 申请人地址： KR Singapore
- 专利权人： STMicroelectronics Asia Pacific PTE LTD (Singapore)
- 当前专利权人： STMicroelectronics Asia Pacific PTE LTD (Singapore)
- 当前专利权人地址： KR Singapore
- 主分类号： H01L23/373
- IPC分类号： H01L23/373 ; H01L23/34
摘要：
A semiconductor package includes a substrate board and a semiconductor die attached to a top surface of that substrate board. A heat spreader is provided over the semiconductor die. A stiffening ring is positioned surrounding the semiconductor die, the stiffening ring being attached to the top surface of the substrate board and attached to a bottom surface of the plate portion of the heat spreader. Space is left on the board outside of the stiffening ring to support the installation of passive components to the substrate board. An external ring may be included, with that external ring being interconnected to the stiffening ring by a set of tie bars. Alternatively, the heat spreader includes an integrally formed peripheral sidewall portion.
公开/授权文献
信息查询
IPC分类:
