Invention Application
US20110036385A1 THERMOELECTRIC COMPOSITE, AND THERMOELECTRIC DEVICE AND THERMOELECTRIC MODULE INCLUDING THE THERMOELECTRIC COMPOSITE
审中-公开
热电复合材料和热电装置以及包含热电复合材料的热电模块
- Patent Title: THERMOELECTRIC COMPOSITE, AND THERMOELECTRIC DEVICE AND THERMOELECTRIC MODULE INCLUDING THE THERMOELECTRIC COMPOSITE
- Patent Title (中): 热电复合材料和热电装置以及包含热电复合材料的热电模块
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Application No.: US12853437Application Date: 2010-08-10
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Publication No.: US20110036385A1Publication Date: 2011-02-17
- Inventor: Kyu-hyoung LEE , Eun-sung LEE , Sang-mock LEE , Hyun-sik KIM
- Applicant: Kyu-hyoung LEE , Eun-sung LEE , Sang-mock LEE , Hyun-sik KIM
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2009-0075729 20090817
- Main IPC: H01L35/12
- IPC: H01L35/12 ; C09K5/00
Abstract:
A thermoelectric composite including a thermoelectric material matrix, a plurality of ceramic nanoparticles, and a bipolar dispersant, wherein the bipolar dispersant bonds the ceramic nanoparticles to the thermoelectric material matrix.
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