-
公开(公告)号：US09516739B2
公开(公告)日：2016-12-06
申请号：US14547673
申请日：2014-11-19
Applicant: Eun Sung Lee , Sang Soo Jee , Kun Mo Chu , Se Yun Kim , Kyu Hyoung Lee , Sang Mock Lee
Inventor： Eun Sung Lee , Sang Soo Jee , Kun Mo Chu , Se Yun Kim , Kyu Hyoung Lee , Sang Mock Lee
CPC classification number: H05K1/0203 , B23K35/26 , C22C45/00 , H01L33/62 , H01L33/641 , H01L33/642 , H01L33/644 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/12044 , H05K3/0061 , H05K3/32 , H05K3/3463 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
Abstract: Disclosed are a heat dissipation material comprising a metallic glass and an organic vehicle and a light emitting diode package including at least one of a junction part, wherein the junction part includes a heat dissipation material including a metallic glass.
-
2.发明授权公开(公告)号：US09065014B2
公开(公告)日：2015-06-23
申请号：US13327940
申请日：2011-12-16
Applicant: Sang-il Kim , Kyu-hyoung Lee , Sang-mock Lee
Inventor： Sang-il Kim , Kyu-hyoung Lee , Sang-mock Lee
Abstract: A thermoelectric material includes powders having a surface coated with an inorganic material. The thermoelectric material includes a thermoelectric semiconductor powder and a coating layer on an outer surface of the thermoelectric semiconductor powders.
Abstract translation: 热电材料包括具有被无机材料涂覆的表面的粉末。 热电材料包括热电半导体粉末和在热电半导体粉末的外表面上的涂层。
-
3.发明授权Heat dissipation material and light emitting diode package including a junction part made of the heat dissipation material 有权散热材料和发光二极管封装，包括由散热材料制成的接合部分公开(公告)号：US09000473B2
公开(公告)日：2015-04-07
申请号：US13213730
申请日：2011-08-19
Applicant: Eun Sung Lee , Sang Soo Jee , Kun Mo Chu , Se Yun Kim , Kyu Hyoung Lee , Sang Mock Lee
Inventor： Eun Sung Lee , Sang Soo Jee , Kun Mo Chu , Se Yun Kim , Kyu Hyoung Lee , Sang Mock Lee
CPC classification number: H05K1/0203 , B23K35/26 , C22C45/00 , H01L33/62 , H01L33/641 , H01L33/642 , H01L33/644 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/12044 , H05K3/0061 , H05K3/32 , H05K3/3463 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
Abstract: Disclosed are a heat dissipation material comprising a metallic glass and an organic vehicle and a light emitting diode package including at least one of a junction part, wherein the junction part includes a heat dissipation material including a metallic glass.
Abstract translation: 公开了包括金属玻璃和有机载体的散热材料和包括接合部分中的至少一个的发光二极管封装，其中所述接合部分包括包括金属玻璃的散热材料。
-
4.发明授权公开(公告)号：US08986566B2
公开(公告)日：2015-03-24
申请号：US13490824
申请日：2012-06-07
Applicant: Kyu-hyoung Lee , Sung-woo Hwang , Sang-il Kim , Sang-mock Lee , Kyung-han Ahn
Inventor： Kyu-hyoung Lee , Sung-woo Hwang , Sang-il Kim , Sang-mock Lee , Kyung-han Ahn
CPC classification number: C01B19/002 , C01P2006/40 , H01L35/16
Abstract: A thermoelectric material including a composition according to Chemical Formula 1: (Bia-xSb1-a-yMb)2-i(TecSe1-c)3-j Chemical Formula 1 wherein M is an element of Group 13, 0≦a≦1, 0
Abstract translation: 包含根据化学式1的组合物的热电材料：（Bia-xSb1-a-yMb）2-i（TecSe1-c）3-j化学式1其中M是第13族的元素，0＆amp; nlE; a＆nlE; 0＆lt; b＆nlE; 0.004,0＆nlE; x＆nlE; b，0＆nlE; y＆nlE; b，x + y = b，0＆nlE; c＆nlE; 1，-0.2＆nlE; i＆nlE; 0.2和-0.2＆
-
5.发明授权Thermoelectric material including nano-inclusions, thermoelectric module and thermoelectric apparatus including the same 有权包括纳米夹杂物，热电模块和包括其的热电装置的热电材料公开(公告)号：US08957299B2
公开(公告)日：2015-02-17
申请号：US13355883
申请日：2012-01-23
Applicant: Sang-il Kim , Kyu-hyoung Lee
Inventor： Sang-il Kim , Kyu-hyoung Lee
CPC classification number: H01L35/16 , B82Y30/00 , B82Y40/00 , H01B1/06 , H01L35/18 , H01L35/26 , Y10T428/25
Abstract: A thermoelectric material including a thermoelectric matrix; and nano-inclusions in the thermoelectric matrix, the nano-inclusions having an average particle diameter of about 10 nanometers to about 30 nanometers.
Abstract translation: 包括热电矩阵的热电材料; 和纳米夹杂物，该纳米夹杂物具有约10纳米至约30纳米的平均粒径。
-
Patent Agency Ranking
6.发明申请公开(公告)号：US20130105725A1
公开(公告)日：2013-05-02
申请号：US13490824
申请日：2012-06-07
Applicant: Kyu-hyoung LEE , Sung-woo HWANG , Sang-il KIM , Sang-mock LEE , Kyung-han AHN
Inventor： Kyu-hyoung LEE , Sung-woo HWANG , Sang-il KIM , Sang-mock LEE , Kyung-han AHN
IPC: C09K5/00
CPC classification number: C01B19/002 , C01P2006/40 , H01L35/16
Abstract: A thermoelectric material including a composition according to Chemical Formula 1: (Bia-xSb1-a-yMb)2-i(TecSe1-c)3-j Chemical Formula 1 wherein M is an element of Group 13, 0≦a≦1, 0
Abstract translation: 包含根据化学式1的组合物的热电材料：（Bia-xSb1-a-yMb）2-i（TecSe1-c）3-j化学式1其中M是第13族的元素，
-
7.发明授权Thermoelectric nanocomposite, thermoelectric element, and thermoelectric module 有权热电纳米复合材料，热电元件和热电模块公开(公告)号：US09147823B2
公开(公告)日：2015-09-29
申请号：US13563292
申请日：2012-07-31
Applicant: Sung-woo Hwang , Kyu-hyoung Lee , Sang-mock Lee
Inventor： Sung-woo Hwang , Kyu-hyoung Lee , Sang-mock Lee
Abstract: A thermoelectric material including a thermoelectric semiconductor; and a nanosheet disposed in the thermoelectric semiconductor, the nanosheet having a layered structure and a thickness from about 0.1 to about 10 nanometers. Also a thermoelectric element and thermoelectric module including the thermoelectric material.
Abstract translation: 包括热电半导体的热电材料; 以及设置在所述热电半导体中的纳米片，所述纳米片具有层状结构，厚度为约0.1至约10纳米。 还有一种包括该热电材料的热电元件和热电模块。
-
8.发明申请THERMOELECTRIC NANOCOMPOSITE, THERMOELECTRIC ELEMENT, AND THERMOELECTRIC MODULE 有权热电纳米复合材料，热电元件和热电模块公开(公告)号：US20130032190A1
公开(公告)日：2013-02-07
申请号：US13563292
申请日：2012-07-31
Applicant: Sung-woo HWANG , Kyu-hyoung LEE , Sang-mock LEE
Inventor： Sung-woo HWANG , Kyu-hyoung LEE , Sang-mock LEE
Abstract: A thermoelectric material including a thermoelectric semiconductor; and a nanosheet disposed in the thermoelectric semiconductor, the nanosheet having a layered structure and a thickness from about 0.1 to about 10 nanometers. Also a thermoelectric element and thermoelectric module including the thermoelectric material.
Abstract translation: 包括热电半导体的热电材料; 以及设置在所述热电半导体中的纳米片，所述纳米片具有层状结构，厚度为约0.1至约10纳米。 还有一种包括该热电材料的热电元件和热电模块。
-
9.发明申请公开(公告)号：US20120186621A1
公开(公告)日：2012-07-26
申请号：US13355883
申请日：2012-01-23
Applicant: Sang-il KIM , Kyu-hyoung LEE
Inventor： Sang-il KIM , Kyu-hyoung LEE
CPC classification number: H01L35/16 , B82Y30/00 , B82Y40/00 , H01B1/06 , H01L35/18 , H01L35/26 , Y10T428/25
Abstract: A thermoelectric material including a thermoelectric matrix; and nano-inclusions in the thermoelectric matrix, the nano-inclusions having an average particle diameter of about 10 nanometers to about 30 nanometers.
Abstract translation: 包括热电矩阵的热电材料; 和纳米夹杂物，该纳米夹杂物具有约10纳米至约30纳米的平均粒径。
-
10.发明申请公开(公告)号：US20120152294A1
公开(公告)日：2012-06-21
申请号：US13327940
申请日：2011-12-16
Applicant: Sang-il KIM , Kyu-hyoung LEE , Sang-mock LEE
Inventor： Sang-il KIM , Kyu-hyoung LEE , Sang-mock LEE
IPC: H01L35/28 , H01B1/02 , H01L35/34 , C25D7/12 , C23C14/35 , C23C14/34 , C23C4/12 , H01B1/00 , C23C16/48
Abstract: A thermoelectric material includes powders having a surface coated with an inorganic material. The thermoelectric material includes a thermoelectric semiconductor powder and a coating layer on an outer surface of the thermoelectric semiconductor powders.
Abstract translation: 热电材料包括具有被无机材料涂覆的表面的粉末。 热电材料包括热电半导体粉末和在热电半导体粉末的外表面上的涂层。
-
-
-
-
-
-
-
-
-
Search Results
22
records
(took 0.029 seconds)
