发明申请
- 专利标题： FILM FORMING APPARATUS AND FILM FORMING METHOD
- 专利标题（中）： 薄膜成型装置和薄膜成型方法
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申请号： US12934165申请日： 2009-03-16
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公开(公告)号： US20110039420A1公开(公告)日： 2011-02-17
- 发明人: Ken Nakao , Muneo Harada
- 申请人： Ken Nakao , Muneo Harada
- 申请人地址： JP Tokyo
- 专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人地址： JP Tokyo
- 优先权： JP2008-078814 20080325
- 国际申请： PCT/JP2009/055034 WO 20090316
- 主分类号： H01L21/47
- IPC分类号： H01L21/47 ; C23C16/00 ; C23C16/44 ; C23C16/46
摘要：
A wall surface of a film forming container is heated to or above a vaporization temperature of a material monomer, which is used to form an organic film, by using an external heater formed along the wall surface of the film forming container, substrates are heated to a thermal polymerization reaction temperature by using an internal heater that is disposed apart from the external heater and near a substrate-supporting container in which the substrates are received, and the organic film is formed through thermal polymerization occurring on the substrates by supplying the material monomer into the film forming container.
公开/授权文献
- US08470720B2 Film forming apparatus and film forming method 公开/授权日：2013-06-25
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