发明申请
- 专利标题： STACKED PACKAGING IMPROVEMENTS
- 专利标题（中）： 堆叠包装改进
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申请号： US12938094申请日： 2010-11-02
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公开(公告)号： US20110042810A1公开(公告)日： 2011-02-24
- 发明人: Belgacem Haba , Craig S. Mitchell , Masud Beroz
- 申请人： Belgacem Haba , Craig S. Mitchell , Masud Beroz
- 申请人地址： US CA San Jose
- 专利权人： TESSERA, INC.
- 当前专利权人： TESSERA, INC.
- 当前专利权人地址： US CA San Jose
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L23/522
摘要：
A plurality of microelectronic assemblies are made by severing an in-process unit including an upper substrate and lower substrate with microelectronic elements disposed between the substrates. In a further embodiment, a lead frame is joined to a substrate so that the leads project from this substrate. Lead frame is joined to a further substrate with one or more microelectronic elements disposed between the substrates.
公开/授权文献
- US08531020B2 Stacked packaging improvements 公开/授权日：2013-09-10
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