发明申请
US20110042857A1 METHOD OF EVALUATING ADHESION PROPERTY, LOW-ADHESION MATERIAL, AND MOLD FOR MOLDING RESIN
审中-公开
评估粘合性能，低粘合材料和模塑树脂模具的方法
- 专利标题： METHOD OF EVALUATING ADHESION PROPERTY, LOW-ADHESION MATERIAL, AND MOLD FOR MOLDING RESIN
- 专利标题（中）： 评估粘合性能，低粘合材料和模塑树脂模具的方法
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申请号： US12914371申请日： 2010-10-28
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公开(公告)号： US20110042857A1公开(公告)日： 2011-02-24
- 发明人: Takaki KUNO , Keiji Maeda , Yoshinori Noguchi , Satoshi Kitaoka , Naoki Kawashima , Seiichi Suda , Masato Yoshiya , Norio Yamaguchi
- 申请人： Takaki KUNO , Keiji Maeda , Yoshinori Noguchi , Satoshi Kitaoka , Naoki Kawashima , Seiichi Suda , Masato Yoshiya , Norio Yamaguchi
- 优先权： JP2004-090894(P) 20040326
- 主分类号： B28B7/36
- IPC分类号： B28B7/36
摘要：
A mold surface (6) of an upper mold (1) with which a fluid resin comes into contact has an oxide (3) therein. The oxide (3) contains a metal cation and an ion. Field strength is calculated based on a valence of the metal cation and an ionic radius of the ion. Based on predetermined relationship established between a value of the field strength and adhesion strength between a cured resin and the mold surface (6), releasability between the cured resin and the mold surface (6) is evaluated. Thereby, a method of evaluating releasability between the cured resin and the mold surface (6) is established. With this evaluation method, a material with high releasability (3) can readily be provided. Further, if the material with high releasability (3) is used for the mold surface (6) of the upper mold (1), a mold for molding a resin having excellent releasability can be obtained.