发明申请
- 专利标题: ELECTRONIC EQUIPMENT AND METHOD FOR CONNECTING ELECTRONIC CIRCUIT SUBSTRATE
- 专利标题(中): 电子设备和连接电子电路基板的方法
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申请号: US12989583申请日: 2009-03-12
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公开(公告)号: US20110043050A1公开(公告)日: 2011-02-24
- 发明人: Masaaki Yabe , Yoshiaki Koizumi , Toshiyasu Higuma , Noriyuki Kushiro
- 申请人: Masaaki Yabe , Yoshiaki Koizumi , Toshiyasu Higuma , Noriyuki Kushiro
- 申请人地址: JP Tokyo
- 专利权人: Mitsubishi Electric Corporation
- 当前专利权人: Mitsubishi Electric Corporation
- 当前专利权人地址: JP Tokyo
- 优先权: JP2008134266 20080522
- 国际申请: PCT/JP2009/054711 WO 20090312
- 主分类号: H02J17/00
- IPC分类号: H02J17/00
摘要:
Wireless power supply and information communication are achieved between electronic circuit substrates in the electronic equipment, and the size of the circuitry for achieving the above is reduced. There are provided a first electronic circuit substrate, a second electronic circuit substrate, a first coil connected to the first electronic circuit substrate, and a second coil connected to the second electronic circuit substrate. Power is transmitted from the first coil to the second coil by electromagnetic induction so that the first electronic circuit substrate and the second electronic circuit substrate are electrically connected.
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