发明申请
US20110043050A1 ELECTRONIC EQUIPMENT AND METHOD FOR CONNECTING ELECTRONIC CIRCUIT SUBSTRATE 有权
电子设备和连接电子电路基板的方法

ELECTRONIC EQUIPMENT AND METHOD FOR CONNECTING ELECTRONIC CIRCUIT SUBSTRATE
摘要:
Wireless power supply and information communication are achieved between electronic circuit substrates in the electronic equipment, and the size of the circuitry for achieving the above is reduced. There are provided a first electronic circuit substrate, a second electronic circuit substrate, a first coil connected to the first electronic circuit substrate, and a second coil connected to the second electronic circuit substrate. Power is transmitted from the first coil to the second coil by electromagnetic induction so that the first electronic circuit substrate and the second electronic circuit substrate are electrically connected.
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