发明申请
- 专利标题： METHOD OF MAKING CIRCUITIZED SUBSTRATE WITH RESISTOR INCLUDING MATERIAL WITH METAL COMPONENT AND ELECTRICAL ASSEMBLY AND INFORMATION HANDLING SYSTEM UTILIZING SAID CIRCUITIZED SUBSTRATE
- 专利标题（中）： 使用包含金属部件的材料制成电路的电路基板的方法以及利用所述电路基板的电气装置和信息处理系统
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申请号： US12938759申请日： 2010-11-03
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公开(公告)号： US20110043987A1公开(公告)日： 2011-02-24
- 发明人: Rabindra N. Das , John M. Lauffer , Voya R. Markovich
- 申请人： Rabindra N. Das , John M. Lauffer , Voya R. Markovich
- 主分类号： G06F1/16
- IPC分类号： G06F1/16 ; H05K7/00 ; B82Y30/00
摘要：
A method of making a circuitized substrate including a resistor comprised of material which includes a polymer resin and a quantity of nano-powders including a mixture of at least one metal component and at least one ceramic component. The ceramic component may be a ferroelectric ceramic and/or a high surface area ceramic and/or a transparent oxide and/or a dope manganite. Alternatively, the material will include the polymer resin and nano-powders, with the nano-powders comprising at least one metal coated ceramic and/or at least one oxide coated metal component. An electrical assembly (substrate and at least one electrical component) and an information handling system (e.g., personal computer) utilizing such a circuitized substrate are also provided.