发明申请
- 专利标题： SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE
- 专利标题（中）： 固态成像装置及其制造方法及电子装置
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申请号： US12860168申请日： 2010-08-20
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公开(公告)号： US20110049336A1公开(公告)日： 2011-03-03
- 发明人: Takeshi Matsunuma
- 申请人： Takeshi Matsunuma
- 申请人地址： JP Tokyo
- 专利权人： SONY CORPORATION
- 当前专利权人： SONY CORPORATION
- 当前专利权人地址： JP Tokyo
- 优先权： JP2009-198118 20090828
- 主分类号： H01L31/09
- IPC分类号： H01L31/09 ; H01L31/0232 ; H01L31/18 ; H01L31/02
摘要：
A solid-state imaging device includes: a plurality of substrates stacked via a wiring layer or an insulation layer; a light sensing section that is formed in a substrate, of the plurality of substrates, disposed on a light incident side and that generates a signal charge in accordance with an amount of received light; and a contact portion that is connected to a non-light incident-surface side of the substrate in which the light sensing section is formed and that supplies a desired voltage to the substrate from a wire in a wiring layer disposed on a non-light incident side of the substrate.
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