Invention Application
- Patent Title: METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE
- Patent Title (中): 制造半导体和半导体封装的方法
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Application No.: US12947031Application Date: 2010-11-16
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Publication No.: US20110057304A1Publication Date: 2011-03-10
- Inventor: Gottfried Beer , Irmgard Escher-Poeppel
- Applicant: Gottfried Beer , Irmgard Escher-Poeppel
- Applicant Address: DE Neubiberg
- Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/60
Abstract:
A method for fabricating a semiconductor chip module and a semiconductor chip package is disclosed. One embodiment provides a first layer, a second layer, and a base layer. The first layer is disposed on the base layer, and the second layer is disposed on the first layer. A plurality of semiconductor chips is applied above the second layer, and the second layer with the applied semiconductor chips is separated from the first layer.
Public/Granted literature
- US08216881B2 Method for fabricating a semiconductor and semiconductor package Public/Granted day:2012-07-10
Information query
IPC分类:
