发明申请
- 专利标题： METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE
- 专利标题（中）： 制造半导体和半导体封装的方法
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申请号： US12947031申请日： 2010-11-16
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公开(公告)号： US20110057304A1公开(公告)日： 2011-03-10
- 发明人: Gottfried Beer , Irmgard Escher-Poeppel
- 申请人： Gottfried Beer , Irmgard Escher-Poeppel
- 申请人地址： DE Neubiberg
- 专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人地址： DE Neubiberg
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L21/60
摘要：
A method for fabricating a semiconductor chip module and a semiconductor chip package is disclosed. One embodiment provides a first layer, a second layer, and a base layer. The first layer is disposed on the base layer, and the second layer is disposed on the first layer. A plurality of semiconductor chips is applied above the second layer, and the second layer with the applied semiconductor chips is separated from the first layer.
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