发明申请
- 专利标题: INTERFACING BETWEEN AN INTEGRATED CIRCUIT AND A WAVEGUIDE
- 专利标题(中): 集成电路与波形之间的接口
-
申请号: US12554987申请日: 2009-09-08
-
公开(公告)号: US20110057741A1公开(公告)日: 2011-03-10
- 发明人: Elad DAYAN , Amir Shmuel , Yigal Leiba , Baruch Schwarz
- 申请人: Elad DAYAN , Amir Shmuel , Yigal Leiba , Baruch Schwarz
- 申请人地址: IL Petach-Tikva
- 专利权人: Siklu Communication Ltd.
- 当前专利权人: Siklu Communication Ltd.
- 当前专利权人地址: IL Petach-Tikva
- 主分类号: H01P5/107
- IPC分类号: H01P5/107
摘要:
A low-loss interface between a mm-wave integrated circuit and a waveguide comprises a surface having a contact location for said integrated circuit and a waveguide location for fixing a waveguide thereon; a transmission line extending along said surface from said contact location to the waveguide location and extending into the waveguide location as a waveguide feed; and a connection bump on a surface of the mm-wave integrated circuit. The mm-wave integrated circuit RFIC is connected to the surface at the contact location through the connection bump, such as to connect a signal output of the RFIC to the transmission line, thereby providing said low loss interface.
公开/授权文献
信息查询