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    Millimeter-wave bare IC mounted within a laminated PCB and usable in a waveguide transition
    2.
    发明授权
    Millimeter-wave bare IC mounted within a laminated PCB and usable in a waveguide transition 有权
    毫米波裸IC安装在层压PCB中，可用于波导过渡

    公开(公告)号：US08912860B2

    公开(公告)日：2014-12-16

    申请号：US13031289

    申请日：2011-02-21

    申请人： Yigal Leiba ,  Elad Dayan ,  Baruch Schwarz ,  Amir Shmuel

    发明人： Yigal Leiba ,  Elad Dayan ,  Baruch Schwarz ,  Amir Shmuel

    IPC分类号： H01P5/107 ,  H01P11/00 ,  H01P3/12

    CPC分类号： H01P5/107 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/15313 ,  H01L2924/16195 ,  H01P3/121 ,  H01P11/002

    摘要： A system enabling interface between a millimeter-wave bare-die and a Printed Circuit Board (PCB). A cavity of depth X is formed in at least one lamina of a PCB. Three electrically conductive pads are printed on one of the laminas of the PCB, the pads optionally reach the edge of the cavity. A bare-die Integrated Circuit having a thickness of optionally X, or a heightened bare-die Integrated Circuit having a thickness of optionally X, output a millimeter-wave signal from three electrically conductive contacts arranged in a ground-signal-ground configuration on an upper side edge of the bare-die Integrated Circuit. The bare-die Integrated Circuit is placed inside the cavity, optionally such that the electrically conductive pads and the upper side edge containing the electrically conductive contacts are arranged side-by-side at substantially the same height. Three bonding wires or strips electrically connect each electrically conductive contact to one of the electrically conductive pads.

    摘要翻译： 一种能够在毫米波裸片和印刷电路板（PCB）之间进行接口的系统。 在PCB的至少一层中形成深度为X的空腔。 三个导电焊盘印刷在PCB的一个层叠板上，焊盘可选择地到达空腔的边缘。 具有可选择的X的厚度的裸片式集成电路或具有任选的X的厚度的升高的裸芯片集成电路输出来自布置在接地信号地配置中的三个导电触点的毫米波信号 裸片集成电路的上侧边缘。 裸模集成电路放置在空腔内，可选地使得导电焊盘和包含导电触头的上侧边缘并排设置在基本相同的高度。 三个接合线或条带将每个导电触点电连接到导电焊盘之一。

    Interfacing between an integrated circuit and a waveguide through a cavity located in a soft laminate
    3.
    发明授权
    Interfacing between an integrated circuit and a waveguide through a cavity located in a soft laminate 有权
    通过位于软层压板中的腔体在集成电路和波导之间进行接合

    公开(公告)号：US08912858B2

    公开(公告)日：2014-12-16

    申请号：US12554987

    申请日：2009-09-08

    申请人： Elad Dayan ,  Amir Shmuel ,  Yigal Leiba ,  Baruch Schwarz

    发明人： Elad Dayan ,  Amir Shmuel ,  Yigal Leiba ,  Baruch Schwarz

    IPC分类号： H01P5/107

    CPC分类号： H01P5/107 ,  Y10T29/49016

    摘要： A low-loss interface between a mm-wave integrated circuit and a waveguide comprises a surface having a contact location for said integrated circuit and a waveguide location for fixing a waveguide thereon; a transmission line extending along said surface from said contact location to the waveguide location and extending into the waveguide location as a waveguide feed; and a connection bump on a surface of the mm-wave integrated circuit. The mm-wave integrated circuit RFIC is connected to the surface at the contact location through the connection bump, such as to connect a signal output of the RFIC to the transmission line, thereby providing said low loss interface.

    摘要翻译： 毫米波集成电路和波导之间的低损耗接口包括具有用于所述集成电路的接触位置的表面和用于在其上固定波导的波导位置; 传输线，沿着所述表面从所述接触位置延伸到波导位置，并作为波导馈送延伸到波导位置; 以及在mm波形集成电路的表面上的连接凸块。 毫米波集成电路RFIC通过连接凸块连接到接触位置处的表面，例如将RFIC的信号输出连接到传输线，从而提供所述低损耗接口。

    INTERFACING BETWEEN AN INTEGRATED CIRCUIT AND A WAVEGUIDE
    4.
    发明申请
    INTERFACING BETWEEN AN INTEGRATED CIRCUIT AND A WAVEGUIDE 有权
    集成电路与波形之间的接口

    公开(公告)号：US20110057741A1

    公开(公告)日：2011-03-10

    申请号：US12554987

    申请日：2009-09-08

    申请人： Elad DAYAN ,  Amir Shmuel ,  Yigal Leiba ,  Baruch Schwarz

    发明人： Elad DAYAN ,  Amir Shmuel ,  Yigal Leiba ,  Baruch Schwarz

    IPC分类号： H01P5/107

    CPC分类号： H01P5/107 ,  Y10T29/49016

    摘要： A low-loss interface between a mm-wave integrated circuit and a waveguide comprises a surface having a contact location for said integrated circuit and a waveguide location for fixing a waveguide thereon; a transmission line extending along said surface from said contact location to the waveguide location and extending into the waveguide location as a waveguide feed; and a connection bump on a surface of the mm-wave integrated circuit. The mm-wave integrated circuit RFIC is connected to the surface at the contact location through the connection bump, such as to connect a signal output of the RFIC to the transmission line, thereby providing said low loss interface.

    摘要翻译： 毫米波集成电路和波导之间的低损耗接口包括具有用于所述集成电路的接触位置的表面和用于在其上固定波导的波导位置; 传输线，沿着所述表面从所述接触位置延伸到波导位置，并作为波导馈送延伸到波导位置; 以及在mm波形集成电路的表面上的连接凸块。 毫米波集成电路RFIC通过连接凸块连接到接触位置处的表面，例如将RFIC的信号输出连接到传输线，从而提供所述低损耗接口。

    Waveguide-backshort comprising a printed conducting layer
    8.
    发明申请
    Waveguide-backshort comprising a printed conducting layer 有权
    波导回溯包括印刷的导电层

    公开(公告)号：US20110140810A1

    公开(公告)日：2011-06-16

    申请号：US13031285

    申请日：2011-02-21

    申请人： Yigal Leiba ,  Elad Dayan ,  Baruch Schwarz ,  Amir Shmuel

    发明人： Yigal Leiba ,  Elad Dayan ,  Baruch Schwarz ,  Amir Shmuel

    IPC分类号： H01P3/12

    CPC分类号： H01P5/107 ,  H01P3/121 ,  H01P11/002

    摘要： A system for directing electromagnetic millimeter-waves towards a waveguide using an electrically conductive formation within a Printed Circuit Board (PCB). The system includes a waveguide having an aperture and at least two laminas belonging to a PCB. A first electrically conductive surface printed on one of the laminas is located over the aperture such that the first electrically conductive surface covers at least most of the aperture. A plurality of Vertical Interconnect Access (VIA) holes, optionally filled or plated with an electrically conductive material, are electrically connecting the first electrically conductive surface to the waveguide, forming an electrically conductive cage over the aperture. Optionally, a probe printed on one of the laminas of the PCB is located inside the cage and over the aperture.

    摘要翻译： 使用印刷电路板（PCB）内的导电结构将电磁毫米波引向波导的系统。 该系统包括具有孔和至少两个属于PCB的薄片的波导。 印刷在一个薄片上的第一导电表面位于孔的上方，使得第一导电表面至少覆盖大部分孔。 可选地填充或镀有导电材料的多个垂直互连访问（VIA）孔将第一导电表面电连接到波导，在孔上形成导电笼。 可选地，印刷在PCB的一个层压板上的探针位于笼内并且在孔上方。

    All digital apparatus for bearing measurement of electromagnetic sources
    9.
    发明授权
    All digital apparatus for bearing measurement of electromagnetic sources 失效
    用于电磁源测量的所有数字设备

    公开(公告)号：US06697017B1

    公开(公告)日：2004-02-24

    申请号：US10129522

    申请日：2002-05-07

    申请人： Amir Shmuel

    发明人： Amir Shmuel

    IPC分类号： G01S316

    CPC分类号： G01S3/48 ,  G01S3/043

    摘要： A device and method for determining the bearing of an incoming RF signal. The signal is received using a plurality of primary antenna element (5). Each antenna element feeds into a respective receiving channel (6) that downconverts the received RF signal to IF, preferably by mixing with a local oscillator signal. The local oscillator signal may be produced by diverting and combining portions of the received RF signals, by receiving the incoming RF signal using one or more auxiliary antennas (11), or by a tunable oscillator. Preferably, the local oscillator signal is conditioned and filtered before mixing. The IF signals are processed, either by analog or digital means, to infer the bearing of the incoming RF signal.

    摘要翻译： 一种用于确定输入RF信号的方位的装置和方法。 使用多个主天线元件（5）接收信号。 每个天线元件馈送到相应的接收信道（6）中，优选地通过与本地振荡器信号混合来将所接收的RF信号下变频到IF。 本地振荡器信号可以通过使用一个或多个辅助天线（11）或可调谐振荡器接收输入RF信号来转发和组合所接收的RF信号的部分来产生。 优选地，在混合之前对本地振荡器信号进行调节和滤波。 IF信号通过模拟或数字方式进行处理，以推断输入RF信号的方位。

    Transition between a laminated PCB and a waveguide including a lamina with a printed conductive surface functioning as a waveguide-backshort
    10.
    发明授权
    Transition between a laminated PCB and a waveguide including a lamina with a printed conductive surface functioning as a waveguide-backshort 有权
    叠层PCB和波导之间的转换，其包括具有用作波导 - 回溯的印刷导电表面的层

    公开(公告)号：US08912859B2

    公开(公告)日：2014-12-16

    申请号：US13031285

    申请日：2011-02-21

    申请人： Yigal Leiba ,  Elad Dayan ,  Baruch Schwarz ,  Amir Shmuel

    发明人： Yigal Leiba ,  Elad Dayan ,  Baruch Schwarz ,  Amir Shmuel

    IPC分类号： H01P5/107 ,  H01P3/12 ,  H01P11/00

    CPC分类号： H01P5/107 ,  H01P3/121 ,  H01P11/002

    摘要： A system for directing electromagnetic millimeter-waves towards a waveguide using an electrically conductive formation within a Printed Circuit Board (PCB). The system includes a waveguide having an aperture and at least two laminas belonging to a PCB. A first electrically conductive surface printed on one of the laminas is located over the aperture such that the first electrically conductive surface covers at least most of the aperture. A plurality of Vertical Interconnect Access (VIA) holes, optionally filled or plated with an electrically conductive material, are electrically connecting the first electrically conductive surface to the waveguide, forming an electrically conductive cage over the aperture. Optionally, a probe printed on one of the laminas of the PCB is located inside the cage and over the aperture.

    摘要翻译： 使用印刷电路板（PCB）内的导电结构将电磁毫米波引向波导的系统。 该系统包括具有孔和至少两个属于PCB的薄片的波导。 印刷在一个薄片上的第一导电表面位于孔的上方，使得第一导电表面至少覆盖大部分孔。 可选地填充或镀有导电材料的多个垂直互连访问（VIA）孔将第一导电表面电连接到波导，在孔上形成导电笼。 可选地，印刷在PCB的一个层压板上的探针位于笼内并且在孔上方。