公开(公告)号：US09203691B2

公开(公告)日：2015-12-01

申请号：US13527927

申请日：2012-06-20

申请人： Baruch Schwarz ,  Ariel Picholtz ,  Yigal Leiba

发明人： Baruch Schwarz ,  Ariel Picholtz ,  Yigal Leiba

IPC分类号： H04W24/00 ,  H04L12/24 ,  H01Q1/24 ,  H01Q21/28

CPC分类号： H04L41/0668 ,  H01Q1/246 ,  H01Q21/28

摘要： Various embodiments of a fail-safe communication system in which certain communication components fail, the system detects the failure, and the system maintains communication by routing data sets to different communication components. In various embodiments, the communication components fail on the network side. In various embodiments, the communication components fail on the remote side. In various embodiments, there are methods for fail-safe communication in which a system detects communication component failure, and routes data sets to other communication components.

摘要翻译： 某些通信组件故障的故障安全通信系统的各种实施例，系统检测到故障，并且系统通过将数据集路由到不同的通信组件而保持通信。 在各种实施例中，通信组件在网络侧失败。 在各种实施例中，通信组件在远程侧失败。 在各种实施例中，存在系统检测通信组件故障并将数据集路由到其他通信组件的故障安全通信的方法。

公开(公告)号：US08912862B2

公开(公告)日：2014-12-16

申请号：US13031291

申请日：2011-02-21

申请人： Yonatan Biran ,  Elad Dayan ,  Yigal Leiba ,  Baruch Schwarz ,  Amir Shmuel

发明人： Yonatan Biran ,  Elad Dayan ,  Yigal Leiba ,  Baruch Schwarz ,  Amir Shmuel

IPC分类号： H01P5/08 ,  H01P5/107 ,  H01P3/12 ,  H01P11/00

CPC分类号： H01P5/107 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/16195 ,  H01P3/121 ,  H01P5/08 ,  H01P11/002 ,  H01L2924/00014

摘要： A system for matching impedances of a bare-die Integrated Circuit and bonding wires. A bare-die Integrated Circuit is configured to output or input, at an impedance of Z3, a millimeter-wave signal from three electrically conductive contacts. Three electrically conductive pads, printed on one of the laminas of a Printed Circuit Board (PCB) are connected to the three electrically conductive contacts via three bonding wires respectively, the bonding wires have a characteristic impedance of Z1, wherein Z1>Z3. One of the electrically conductive pads extends to form a transmission line signal trace of length L, the transmission line signal trace having a first width resulting in characteristic impedance of Z2, wherein Z2>Z3. The transmission line signal trace widens to a second width, higher than the first width, after the length of L, decreasing the characteristic impedance of the transmission line signal trace to substantially Z3 after the length L and onwards.

摘要翻译： 用于匹配裸片集成电路和接合线的阻抗的系统。 裸片集成电路被配置为以三个导电触点的Z3的阻抗输出或输入毫米波信号。 印刷在印刷电路板（PCB）的层叠之一上的三个导电焊盘分别通过三个接合线连接到三个导电触点，接合线具有Z1的特性阻抗，其中Z1> Z3。 导电焊盘中的一个延伸以形成长度为L的传输线信号迹线，传输线信号迹线具有导致Z2的特性阻抗的第一宽度，其中Z2> Z3。 在长度L之后，传输线信号迹线扩大到高于第一宽度的第二宽度，在传输线信号迹线的特征阻抗在长度L和之后将其基本上减小到Z3。

公开(公告)号：US08536954B2

公开(公告)日：2013-09-17

申请号：US12791936

申请日：2010-06-02

申请人： Yigal Leiba ,  Elad Dayan

发明人： Yigal Leiba ,  Elad Dayan

IPC分类号： H01P5/107

CPC分类号： H05K3/4697 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L2224/05554 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01Q1/2283 ,  H05K1/0219 ,  H05K1/0243 ,  H05K1/025 ,  H05K1/185 ,  H05K3/4629 ,  H05K2201/09618 ,  H05K2201/09727 ,  H05K2201/10098 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/05599

摘要： Millimeter wave radio-frequency integrated circuit device comprises a housing and a millimeter wave radio frequency integrated circuit, the housing comprising a plurality of layers laminated together and two cavities defined by apertures within the layers which are positioned to correspond as the layers are laminated together. The radio frequency integrated circuit is located within the first cavity, and the second cavity serves as a radiating cavity. The RFIC is bonded to a transmission line which connects to the radiating cavity.

摘要翻译： 毫米波射频集成电路装置包括外壳和毫米波射频集成电路，所述外壳包括层叠在一起的多个层和由所述层内的孔限定的两个空腔，所述孔被定位成层叠在一起时对应。 射频集成电路位于第一腔内，第二腔用作辐射腔。 RFIC结合到连接到辐射腔的传输线。

公开(公告)号：US20110140811A1

公开(公告)日：2011-06-16

申请号：US13031289

申请日：2011-02-21

申请人： Yigal Leiba ,  Elad Dayan ,  Baruch Schwarz ,  Amir Shmuel

发明人： Yigal Leiba ,  Elad Dayan ,  Baruch Schwarz ,  Amir Shmuel

IPC分类号： H01P5/00

CPC分类号： H01P5/107 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/15313 ,  H01L2924/16195 ,  H01P3/121 ,  H01P11/002

摘要： A system enabling interface between a millimeter-wave bare-die and a Printed Circuit Board (PCB). A cavity of depth X is formed in at least one lamina of a PCB. Three electrically conductive pads are printed on one of the laminas of the PCB, the pads optionally reach the edge of the cavity. A bare-die Integrated Circuit having a thickness of optionally X, or a heightened bare-die Integrated Circuit having a thickness of optionally X, output a millimeter-wave signal from three electrically conductive contacts arranged in a ground-signal-ground configuration on an upper side edge of the bare-die Integrated Circuit. The bare-die Integrated Circuit is placed inside the cavity, optionally such that the electrically conductive pads and the upper side edge containing the electrically conductive contacts are arranged side-by-side at substantially the same height. Three bonding wires or strips electrically connect each electrically conductive contact to one of the electrically conductive pads.

摘要翻译： 一种能够在毫米波裸片和印刷电路板（PCB）之间进行接口的系统。 在PCB的至少一层中形成深度为X的空腔。 三个导电焊盘印刷在PCB的一个层叠板上，焊盘可选择地到达空腔的边缘。 具有可选择的X的厚度的裸片式集成电路或具有任选的X的厚度的升高的裸芯片集成电路输出来自布置在接地信号地配置中的三个导电触点的毫米波信号 裸片集成电路的上侧边缘。 裸模集成电路放置在空腔内，可选地使得导电焊盘和包含导电触头的上侧边缘并排设置在基本相同的高度。 三个接合线或条带将每个导电触点电连接到导电焊盘之一。

公开(公告)号：US20110138619A1

公开(公告)日：2011-06-16

申请号：US13031294

申请日：2011-02-21

申请人： Elad Dayan ,  Yigal Leiba ,  Baruch Schwarz ,  Amir Shmuel

发明人： Elad Dayan ,  Yigal Leiba ,  Baruch Schwarz ,  Amir Shmuel

IPC分类号： H05K3/36

CPC分类号： H01P5/107 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/15313 ,  H01L2924/16195 ,  H01P3/121 ,  H01P5/028 ,  H01P11/002 ,  H01P11/003 ,  Y10T29/49016 ,  Y10T29/49126

摘要： A method for constructing millimeter-wave laminate structures using Printed Circuit Board (PCB) processes includes the following steps: Creating a first pressed laminate structure comprising at least two laminas and a cavity, the cavity is shaped as an aperture of a waveguide, and goes perpendicularly through all laminas of the laminate structure. Plating the cavity with electrically conductive plating, using a PCB plating process. Pressing the first pressed laminate structure together with at least two additional laminas comprising a probe printed on one of the at least two additional laminas, into a PCB comprising the first pressed laminate structure and the additional laminas, such that the cavity is sealed only from one end by the additional laminas and the probe, and the probe is positioned above the cavity.

摘要翻译： 使用印刷电路板（PCB）工艺构建毫米波层压结构的方法包括以下步骤：创建包括至少两个薄片和空腔的第一压制叠层结构，该腔被定形为波导的孔，并且进入 垂直地穿过层压结构的所有层叠体。 使用PCB电镀工艺将导电电镀电镀。 将第一压制的层压结构与至少两个另外的层叠体一起压制成包括在至少两个另外的薄片之一上印刷的探针的PCB，其包括第一压制层压结构和附加薄片，使得仅从一个 通过附加的薄片和探针结束，并且探针位于空腔上方。

公开(公告)号：US09425985B1

公开(公告)日：2016-08-23

申请号：US12872727

申请日：2010-08-31

申请人： Leonid Shousterman ,  Yigal Leiba

发明人： Leonid Shousterman ,  Yigal Leiba

IPC分类号： H04L12/46 ,  H04L12/721 ,  H04L12/911 ,  H04L29/08

CPC分类号： H04L12/4625 ,  H04L12/462 ,  H04L45/22 ,  H04L45/28 ,  H04L45/66 ,  H04L47/726 ,  H04L67/322 ,  H04W40/00

摘要： A system for protection switching in radio networks includes a plurality of nodes, a plurality of links of Ethernet interconnecting the nodes and forming a network, at least one wireless link interconnecting two of the nodes, and two Virtual Local Area Networks (VLAN) within the network, only the first VLAN comprising the wireless link. The network transports packets of Ethernet associated with a first Classes of Service (CoS) and a second CoS via the first VLAN. Upon detection of a reduction in performance of the wireless link, the network maps the second CoS to the second VLAN, and by that offloading traffic associated with the second CoS from the wireless link.

摘要翻译： 一种用于无线电网络中的保护倒换的系统包括多个节点，以太网互连节点并形成网络的多个链路，至少一个互连两个节点的无线链路，以及两个虚拟局域网（VLAN）内的虚拟局域网 网络，只有包含无线链路的第一个VLAN。 网络通过第一个VLAN传输与第一个服务等级（CoS）和第二个CoS相关联的以太网数据包。 在检测到无线链路的性能降低时，网络将第二CoS映射到第二VLAN，并且通过从无线链路卸载与第二CoS相关联的业务。

公开(公告)号：US09270005B2

公开(公告)日：2016-02-23

申请号：US13527698

申请日：2012-06-20

申请人： Yigal Leiba ,  Elad Dayan

发明人： Yigal Leiba ,  Elad Dayan

IPC分类号： H01P5/107 ,  H01P3/00 ,  H01P3/12 ,  H01P11/00

CPC分类号： H01P5/107 ,  H01P3/003 ,  H01P3/121 ,  H01P11/002 ,  Y10T156/1052

摘要： Various embodiments of millimeter-wave systems on a printed circuit board, including a microstrip, a probe, and an RF integrated circuit, as well as methods for manufacturing said systems. Various embodiments have holes extending through lamina in the PCB, thereby improving radiation propagation. Various embodiments have conductive cages created by multiple through-holes extending through lamina in the PCB, thereby increasing radiation propagation. The manufacture of such systems is easier and less expensive than the manufacture of current systems.

摘要翻译： 包括微带，探针和RF集成电路的印刷电路板上的毫米波系统的各种实施例，以及用于制造所述系统的方法。 各种实施例具有延伸穿过PCB中的层的孔，从而改善辐射传播。 各种实施例具有通过延伸穿过PCB中的层的多个通孔产生的导电笼，从而增加辐射传播。 这种系统的制造比当前系统的制造更容易且更便宜。

公开(公告)号：US08912859B2

公开(公告)日：2014-12-16

申请号：US13031285

申请日：2011-02-21

申请人： Yigal Leiba ,  Elad Dayan ,  Baruch Schwarz ,  Amir Shmuel

发明人： Yigal Leiba ,  Elad Dayan ,  Baruch Schwarz ,  Amir Shmuel

IPC分类号： H01P5/107 ,  H01P3/12 ,  H01P11/00

CPC分类号： H01P5/107 ,  H01P3/121 ,  H01P11/002

摘要： A system for directing electromagnetic millimeter-waves towards a waveguide using an electrically conductive formation within a Printed Circuit Board (PCB). The system includes a waveguide having an aperture and at least two laminas belonging to a PCB. A first electrically conductive surface printed on one of the laminas is located over the aperture such that the first electrically conductive surface covers at least most of the aperture. A plurality of Vertical Interconnect Access (VIA) holes, optionally filled or plated with an electrically conductive material, are electrically connecting the first electrically conductive surface to the waveguide, forming an electrically conductive cage over the aperture. Optionally, a probe printed on one of the laminas of the PCB is located inside the cage and over the aperture.

摘要翻译： 使用印刷电路板（PCB）内的导电结构将电磁毫米波引向波导的系统。 该系统包括具有孔和至少两个属于PCB的薄片的波导。 印刷在一个薄片上的第一导电表面位于孔的上方，使得第一导电表面至少覆盖大部分孔。 可选地填充或镀有导电材料的多个垂直互连访问（VIA）孔将第一导电表面电连接到波导，在孔上形成导电笼。 可选地，印刷在PCB的一个层压板上的探针位于笼内并且在孔上方。

公开(公告)号：US08416836B2

公开(公告)日：2013-04-09

申请号：US12892942

申请日：2010-09-29

申请人： Izhak Kirshenbaum ,  Baruch Schwarz ,  Yigal Leiba

发明人： Izhak Kirshenbaum ,  Baruch Schwarz ,  Yigal Leiba

IPC分类号： H04B1/00

CPC分类号： H04L27/2647 ,  H04L27/2626

摘要： A Point-to-Point communication system includes (i) a millimeter-wave channel having a substantially flat channel transfer function between a first frequency of millimeter-waves and a second frequency of millimeter-waves, the two frequencies are separated by at least 500 MHz, (ii) a transmission system configured to transmit an Orthogonal Frequency Division Multiplexing (OFDM) signal having a bandwidth of at least 100 MHz over the millimeter-wave channel as a millimeter-wave signal located between the first frequency and the second frequency, and (iii) a reception system comprising a radio receiver having a substantially non-flat reception transfer function over the bandwidth of the OFDM signal, configured to receive the millimeter-wave signal via the millimeter-wave channel and down-convert the millimeter-wave signal into a reconstruction of the OFDM signal having a bandwidth of at least 100 MHz, and an OFDM de-modulator configured to compensate for the substantially non-flat reception transfer function, by de-modulating the reconstruction of the OFDM signal.

摘要翻译： 点对点通信系统包括（i）具有在毫米波的第一频率和第二毫米波频率之间的基本平坦的信道传递函数的毫米波信道，两个频率被分开至少500 MHz，（ii）被配置为在毫米波信道上传送具有至少100MHz的带宽的正交频分复用（OFDM）信号作为位于第一频率和第二频率之间的毫米波信号的传输系统， 以及（iii）包括无线电接收机的接收系统，所述无线电接收机在所述OFDM信号的带宽上具有基本上非平坦的接收传递功能，被配置为经由所述毫米波信道接收所述毫米波信号并且下变频所述毫米波 信号转换为具有至少100MHz的带宽的OFDM信号的重构，以及被配置为补偿基本上非平坦接收的OFDM解调器 传递函数，通过解调OFDM信号的重构。

公开(公告)号：US20120257495A1

公开(公告)日：2012-10-11

申请号：US13527927

申请日：2012-06-20

申请人： Baruch Schwarz ,  Ariel Picholtz ,  Yigal Leiba

发明人： Baruch Schwarz ,  Ariel Picholtz ,  Yigal Leiba

IPC分类号： H04L12/26 ,  H04W24/00

CPC分类号： H04L41/0668 ,  H01Q1/246 ,  H01Q21/28

摘要： Various embodiments of a fail-safe communication system in which certain communication components fail, the system detects the failure, and the system maintains communication by routing data sets to different communication components. In various embodiments, the communication components fail on the network side. In various embodiments, the communication components fail on the remote side. In various embodiments, there are methods for fail-safe communication in which a system detects communication component failure, and routes data sets to other communication components.

摘要翻译： 某些通信组件故障的故障安全通信系统的各种实施例，系统检测到故障，并且系统通过将数据集路由到不同的通信组件而保持通信。 在各种实施例中，通信组件在网络侧失败。 在各种实施例中，通信组件在远程侧失败。 在各种实施例中，存在系统检测通信组件故障并将数据集路由到其他通信组件的故障安全通信的方法。