发明申请
- 专利标题: AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING AND CHEMICAL MECHANICAL POLISHING METHOD
- 专利标题(中): 化学机械抛光和化学机械抛光方法的水分散
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申请号: US12867954申请日: 2008-12-18
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公开(公告)号: US20110059680A1公开(公告)日: 2011-03-10
- 发明人: Masayuki Motonari , Eiichirou Kunitani , Tomikazu Ueno , Takahiro Iijima , Takashi Matsuda
- 申请人: Masayuki Motonari , Eiichirou Kunitani , Tomikazu Ueno , Takahiro Iijima , Takashi Matsuda
- 申请人地址: JP Tokyo
- 专利权人: JSR Corporation
- 当前专利权人: JSR Corporation
- 当前专利权人地址: JP Tokyo
- 优先权: JP2008-035507 20080218; JP2008-145787 20080603
- 国际申请: PCT/JP2008/073082 WO 20081218
- 主分类号: B24B1/00
- IPC分类号: B24B1/00 ; C09K13/00
摘要:
A chemical mechanical polishing aqueous dispersion includes (A) a graft polymer that includes an anionic functional group in a trunk polymer, and (B) abrasive grains.