公开(公告)号：US20110059680A1

公开(公告)日：2011-03-10

申请号：US12867954

申请日：2008-12-18

申请人： Masayuki Motonari ,  Eiichirou Kunitani ,  Tomikazu Ueno ,  Takahiro Iijima ,  Takashi Matsuda

发明人： Masayuki Motonari ,  Eiichirou Kunitani ,  Tomikazu Ueno ,  Takahiro Iijima ,  Takashi Matsuda

IPC分类号： B24B1/00 ,  C09K13/00

CPC分类号： H01L21/31053 ,  C09G1/02 ,  C09K3/1463 ,  H01L21/3212

摘要： A chemical mechanical polishing aqueous dispersion includes (A) a graft polymer that includes an anionic functional group in a trunk polymer, and (B) abrasive grains.

摘要翻译： 化学机械研磨用水系分散体包含（A）在树脂聚合物中含有阴离子官能团的接枝聚合物，（B）磨粒。

公开(公告)号：US07335531B2

公开(公告)日：2008-02-26

申请号：US11130845

申请日：2005-05-17

申请人： Takahiro Iijima ,  Akio Rokugawa

发明人： Takahiro Iijima ,  Akio Rokugawa

IPC分类号： H01L21/44

CPC分类号： H01L23/49822 ,  H01G4/33 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05027 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2924/01078 ,  H01L2924/15311 ,  H05K1/185 ,  H05K1/187

摘要： A semiconductor device including a semiconductor device package providing a capacitor in its circuit board and a semiconductor chip mounted on that package, wherein the capacitor is provided directly under a semiconductor chip mounting surface of the circuit board on which the semiconductor chip is to be mounted and the conductor circuit electrically connecting the semiconductor chip and capacitor is made the shortest distance by having the external connection terminals of the capacitor directly connected to the other surface of the connection pads exposed at one surface at the semiconductor chip mounting surface of the circuit board and to which the electrode terminals of the semiconductor chip are to be directly connected.

摘要翻译： 一种半导体器件，包括在其电路板中提供电容器的半导体器件封装和安装在该封装上的半导体芯片，其中电容器直接设置在要安装半导体芯片的电路板的半导体芯片安装表面下方， 电连接半导体芯片和电容器的导体电路通过使电容器的外部连接端子直接连接到在电路板的半导体芯片安装表面的一个表面处露出的连接焊盘的另一个表面而成为最短距离，并且 其中半导体芯片的电极端子将被直接连接。

公开(公告)号：US20060110838A1

公开(公告)日：2006-05-25

申请号：US11324220

申请日：2006-01-04

申请人： Akio Rokugawa ,  Takahiro Iijima

发明人： Akio Rokugawa ,  Takahiro Iijima

IPC分类号： H01L21/66

CPC分类号： H01L23/49531 ,  H01L21/4857 ,  H01L21/6835 ,  H01L24/48 ,  H01L25/0655 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/45099 ,  H01L2224/48247 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H05K1/113 ,  H05K3/0061 ,  H05K3/205 ,  H05K3/323 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4682 ,  H05K2201/0133 ,  H05K2201/09527 ,  H05K2203/061 ,  Y10T29/49126 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A multi-layered circuit substrate for a semiconductor device comprises a multi-layered circuit substrate body having first and second surfaces and comprising a plurality of conductive pattern layers integrally laminated one on the other from the first surface to the second surface, so that a plurality of semiconductor device elements can be arranged on the first surface of the substrate body; and a plate member, a rigidity thereof being higher than that of the substrate body, attached to the second surface of the substrate body. A plurality of semiconductor elements can be mounted on the semiconductor element mounting surface defined on the first surface of the substrate body.

公开(公告)号：USD488791S1

公开(公告)日：2004-04-20

申请号：US29183880

申请日：2003-06-17

申请人： Sugiko Honda ,  Norio Okada ,  Takahiro Iijima

设计人： Sugiko Honda ,  Norio Okada ,  Takahiro Iijima

公开(公告)号：USD477581S1

公开(公告)日：2003-07-22

申请号：US29163258

申请日：2002-07-01

申请人： Takahiro Iijima ,  Takayuki Miyazawa

设计人： Takahiro Iijima ,  Takayuki Miyazawa

公开(公告)号：US4536455A

公开(公告)日：1985-08-20

申请号：US517292

申请日：1983-07-26

申请人： Keikichi Maeda ,  Takahiro Iijima ,  Eiichi Sato

发明人： Keikichi Maeda ,  Takahiro Iijima ,  Eiichi Sato

IPC分类号： F16L9/02 ,  B01J19/00 ,  B22D13/00 ,  B22D13/02 ,  B22D19/16 ,  C10G9/16 ,  B32B15/00

CPC分类号： B22D19/16 ,  B01J19/0026 ,  B22D13/02 ,  C10G9/16 ,  Y10T428/1259 ,  Y10T428/12778 ,  Y10T428/12931 ,  Y10T428/12937 ,  Y10T428/12944 ,  Y10T428/12958 ,  Y10T428/12965 ,  Y10T428/12979

摘要： A centrifugally cast double-layer tube with resistance to carbon deposition, comprising an inner layer of a specific metallic material containing 1-10 wt % of Al and an outer layer of a heat resisting metallic material, can be applied to apparatuses for treating a fluid, containing hydrocarbons, their derivatives, or carbon monoxide, at elevated temperatures and to piping for transferring the fluid without carbon deposition on its inside surface, because the surface of said inner layer is oxidized to form a firm Al-containing oxide film prior to and/or during the treatment of the fluid, and also a sufficient strength and ductility of the tube are preserved by the support of the outer layer of said tube.

摘要翻译： 具有耐碳沉积的离心铸造双层管，其包含含有1-10重量％的Al的特定金属材料的内层和耐热金属材料的外层，可以应用于用于处理流体的装置 在高温下含有碳氢化合物，其衍生物或一氧化碳，以及用于在没有碳沉积的情况下在其内表面上转移流体的管道，因为所述内层的表面在氧化之前被氧化以形成坚固的含Al氧化物膜 /或在处理流体期间，并且还通过所述管的外层的支撑来保持管的足够的强度和延展性。

公开(公告)号：US07250355B2

公开(公告)日：2007-07-31

申请号：US11324220

申请日：2006-01-04

申请人： Akio Rokugawa ,  Takahiro Iijima

发明人： Akio Rokugawa ,  Takahiro Iijima

IPC分类号： H01L21/46

CPC分类号： H01L23/49531 ,  H01L21/4857 ,  H01L21/6835 ,  H01L24/48 ,  H01L25/0655 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/45099 ,  H01L2224/48247 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H05K1/113 ,  H05K3/0061 ,  H05K3/205 ,  H05K3/323 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4682 ,  H05K2201/0133 ,  H05K2201/09527 ,  H05K2203/061 ,  Y10T29/49126 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A multi-layered circuit substrate for a semiconductor device comprises a multi-layered circuit substrate body having first and second surfaces and comprising a plurality of conductive pattern layers integrally laminated one on the other from the first surface to the second surface, so that a plurality of semiconductor device elements can be arranged on the first surface of the substrate body; and a plate member, a rigidity thereof being higher than that of the substrate body, attached to the second surface of the substrate body. A plurality of semiconductor elements can be mounted on the semiconductor element mounting surface defined on the first surface of the substrate body.

摘要翻译： 一种用于半导体器件的多层电路衬底包括具有第一和第二表面的多层电路衬底本体，并且包括从第一表面到第二表面一个层叠在一起的多个导电图案层，使得多个 的半导体器件元件可以布置在基板主体的第一表面上; 以及板构件，其刚度高于基板主体的刚度，附着到基板主体的第二表面。 多个半导体元件可以安装在限定在基板主体的第一表面上的半导体元件安装面上。

公开(公告)号：US20050253248A1

公开(公告)日：2005-11-17

申请号：US11128813

申请日：2005-05-13

申请人： Noriyoshi Shimizu ,  Tomoo Yamasaki ,  Akio Rokugawa ,  Takahiro Iijima

发明人： Noriyoshi Shimizu ,  Tomoo Yamasaki ,  Akio Rokugawa ,  Takahiro Iijima

IPC分类号： H05K3/46 ,  H01L21/48 ,  H01L21/60 ,  H01L23/12 ,  H01L23/498 ,  H01L23/50 ,  H01L29/76 ,  H05K1/16

CPC分类号： H01L24/81 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49894 ,  H01L23/50 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15312 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/30107 ,  H05K1/162 ,  H05K3/4644 ,  H05K2201/0209 ,  H05K2203/135 ,  H01L2924/00

摘要： A multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring structure is disclosed. The multilayer wiring substrate includes a dielectric layer including a resin material mixed with an inorganic filler, wherein the inorganic filler is fabricated by mixing a paraelectric filler with an inorganic filler having a high dielectric constant.

摘要翻译： 公开了一种用于在多层布线结构内提供电容器结构的多层布线基板。 多层布线基板包括具有与无机填料混合的树脂材料的电介质层，其中无机填料是通过将正电介质填料与具有高介电常数的无机填料混合来制造的。

公开(公告)号：US06891732B2

公开(公告)日：2005-05-10

申请号：US10244210

申请日：2002-09-16

申请人： Akihito Takano ,  Takahiro Iijima

发明人： Akihito Takano ,  Takahiro Iijima

IPC分类号： H05K1/05 ,  H01L23/10 ,  H01L23/12 ,  H01L23/36 ,  H05K1/02 ,  H05K1/18 ,  H05K3/44 ,  H05K3/46 ,  H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC分类号： H05K1/0206 ,  H01L23/10 ,  H01L23/36 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/15311 ,  H05K3/44 ,  H05K3/4608 ,  H05K2201/09554 ,  H05K2201/096

摘要： A multilayer circuit board for mounting a semiconductor element thereon, comprising a core substrate of a metal material and a plurality of wiring layers stacked on either side of the core substrate, each of the stacked wiring layers being isolated from an adjacent wiring layer by an insulating layer interposed therebetween, the multilayer circuit board having an area at which a heat spreader for dissipating heat generated from the semiconductor element mounted on the circuit board is to be joined to the multilayer circuit board, wherein the multilayer circuit board allows the heat spreader to be joined to the core substrate without the insulating layers being interposed therebetween. A semiconductor device using the multilayer circuit board is also disclosed.

摘要翻译： 一种用于在其上安装半导体元件的多层电路板，包括金属材料的芯基板和堆叠在芯基板的两侧的多个布线层，每个堆叠的布线层通过绝缘体与相邻布线层隔离 层叠电路板，其中，多层电路板具有用于散热从安装在电路板上的半导体元件产生的散热器的散热器与多层电路板接合的区域，其中多层电路板允许散热器为 连接到芯基板上，绝缘层之间插入其中。 还公开了一种使用该多层电路板的半导体器件。

公开(公告)号：US06783652B2

公开(公告)日：2004-08-31

申请号：US09997665

申请日：2001-11-26

申请人： Takahiro Iijima ,  Akio Rokugawa ,  Yasuyoshi Horikawa

发明人： Takahiro Iijima ,  Akio Rokugawa ,  Yasuyoshi Horikawa

IPC分类号： C25D502

CPC分类号： H05K3/045 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K3/005 ,  H05K3/107 ,  H05K3/28 ,  H05K3/4007 ,  H05K3/423 ,  H05K3/426 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2203/0108

摘要： A resin plate having wiring pattern recesses and via through holes is made. All of the surfaces of the resin plate including inner walls of the wiring pattern recesses and via through holes are coated with a metal film. An electro-plating is applied using the metal film as a power-supply layer to fill a plated metal into the wiring pattern recesses and via through holes. The metal film formed on the resin plate except for the inner walls of the wiring pattern recesses and via through holes is removed, so that wiring pattern and via are exposed on a surface the same as that of the resin plate.

摘要翻译： 制成具有布线图形凹部和通孔的树脂板。 包括布线图案凹槽的内壁和通孔的树脂板的所有表面均涂覆有金属膜。 使用金属膜作为电源层施加电镀，以将电镀金属填充到布线图案凹部和通孔中。 去除了除了布线图形凹部和通路孔的内壁之外的树脂板上形成的金属膜，使得布线图案和通路露出在与树脂板相同的表面上。