发明申请
- 专利标题： PRESSURE-SENSITIVE ADHESIVE SHEET AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE HAVING SAME
- 专利标题（中）： 压敏粘合片及其制造方法
-
申请号： US12513316申请日： 2008-10-09
-
公开(公告)号： US20110065217A1公开(公告)日： 2011-03-17
- 发明人: Yoshio Terada , Fumiteru Asai , Hirokuni Hashimoto
- 申请人： Yoshio Terada , Fumiteru Asai , Hirokuni Hashimoto
- 优先权： JP2007-291248 20071108; JP2007-291251 20071108; JP2007-291254 20071108; JP2007-295526 20071114
- 国际申请： PCT/JP2008/068340 WO 20081009
- 主分类号： H01L21/66
- IPC分类号： H01L21/66 ; B32B7/12
摘要：
A pressure-sensitive adhesive sheet according to the present invention is a pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive layer is provided on a base film, in which the base film contains conductive fibers, and in which an electrically conductive path is formed between the pressure-sensitive adhesive layer and the base film. With this structure, an electrical continuity test can be performed even in a condition where a semiconductor wafer or a semiconductor chip formed by dicing the semiconductor wafer is applied, and deformation (warping) and damage of the semiconductor wafer and generation of flaws and scratches on the backside can be prevented in the test.
公开/授权文献
信息查询
IPC分类:
